Abstract: An information processing system includes a processor configured to: receive question data input from a user; in generation of answer data to the question data using file data to which it is preset whether or not the user has an access right, in a case where access to the file data is restricted or prohibited by the access right of the user, control the use of the file data in the generation of the answer data independently of control of the access right to generate the answer data; and present the answer data to the user.

Abstract: A metal plate is embedded in a printed circuit board. A semiconductor package includes a semiconductor chip and is provided with connection terminals, which electrically connect the semiconductor chip and the printed circuit board, on a surface that faces a surface of the printed circuit board. Out of a gap between the surface and the surface, a first region that covers the connection terminals is filled with a first filling material, and in the gap, at least a part of a second region where the semiconductor chip and the metal plate overlap in plan view is filled with a second filling material with higher thermal conductivity than the first filling material.

Abstract: A semiconductor device with an antenna includes a heat sink having first and second surfaces, a semiconductor chip provided on the second surface and having a circuit surface, a wiring board having a laminate of alternately disposed insulating layers and interconnect layers, and covering side surfaces of the heat sink and the semiconductor chip and the circuit surface, and exposing the first surface, and an antenna provided on the wiring board. The wiring board includes a board connecting part provided on an opposite side from the antenna, a first interconnect electrically connecting the board connecting part and a first terminal provided on the circuit surface, and a second interconnect electrically connecting the antenna and a second terminal provided on the circuit surface.

Abstract: The present invention relates to a medicament for treating neuropsychiatric diseases, comprising a compound of Formula (1): or a pharmaceutically acceptable salt thereof, as an active ingredient.

Abstract: The present invention relates to a medicament for treating neuropsychiatric diseases, comprising a compound of Formula (1): or a pharmaceutically acceptable salt thereof, as an active ingredient.

Abstract: An operation assist apparatus is provided with storage boxes, a three-dimensional sensor, and a processor. The storage boxes store an article. The three-dimensional sensor detects a position of at least a part of a surface of an object that exists in detection regions respectively provided to the storage boxes and generates a distance image that represents a distance to at least a part of the detected surface. The processor judges whether the object takes out the article stored in the storage boxes or whether the object stores the article in the storage boxes, based on the position of at least a part of the surface. In addition, the processor judges, when a number of pixels that represent at least a part of the surface in the distance image is greater than a threshold value, that the object takes out the article or stores the article in the storage boxes.

Abstract: An information processing system includes one or multiple processors configured to: identify, from display elements of AR content, 3D model data for an object obtained as a result of comparison with one or more objects among objects, each serving as a subject of a captured image; and replace the identified 3D model data with 3D model data for the object serving as the subject.

Abstract: An information processing device includes a processor configured to: be capable of accessing a memory storing content information in which image features are each associated with a corresponding display element, the display element being displayed on a display unit when the image feature is detected from a movie displayed on the display unit; detect, from a target movie which is a target to be processed, image features in accordance with a predetermined rule; and, in response to a difference between the image features detected from the target movie and the image features included in the content information, modify the content information on the basis of the difference.

Abstract: A semiconductor device includes: a semiconductor layer having a surface; a first region and a second region of a first conductivity type, which are spaced apart from each other in a first direction on the surface and extend in a second direction orthogonal to the first direction, when viewed from a thickness direction orthogonal to the surface; a channel region of a second conductivity type; a gate electrode arranged on the channel region via a gate insulating film; a plurality of drift regions of a first conductivity type and a plurality of column regions of the second conductivity type; a buffer region of the first conductivity type; and at least one collector region of the second conductivity type.

Abstract: A semiconductor device with an antenna includes a heat sink having first and second surfaces, a semiconductor chip provided on the second surface and having a circuit surface, a wiring board having a laminate of alternately disposed insulating layers and interconnect layers, and covering side surfaces of the heat sink and the semiconductor chip and the circuit surface, and exposing the first surface, and an antenna provided on the wiring board. The wiring board includes a board connecting part provided on an opposite side from the antenna, a first interconnect electrically connecting the board connecting part and a first terminal provided on the circuit surface, and a second interconnect electrically connecting the antenna and a second terminal provided on the circuit surface.

Abstract: A new substrate manufacturing method of obtaining a SiC epitaxial substrate having excellent flatness and a SiC epitaxial substrate having excellent flatness are provided. In a SiC epitaxial substrate having an epitaxial film obtained by epitaxially growing silicon carbide on a front surface of a silicon carbide substrate, the SiC epitaxial substrate has a first main surface made of the epitaxial film and a second main surface opposite to the first main surface. A maximum value of SBIR on the second main surface based on a 10 mm square site satisfies a condition of 0.1 µm or more and 1.5 µm or less.

Abstract: The present invention relates to a medicament for treating neuropsychiatric diseases, comprising a compound of Formula (1): or a pharmaceutically acceptable salt thereof, as an active ingredient.

Abstract: The present invention relates to a medicament for treating neuropsychiatric diseases, comprising a compound of Formula (1): or a pharmaceutically acceptable salt thereof, as an active ingredient.

Abstract: A semiconductor device includes: a semiconductor substrate; an electrode pad disposed over a first face of the semiconductor substrate; a redistribution layer electrically connected to the electrode pad; a through hole disposed in the semiconductor substrate so as to extend from a second face opposite to the first face of the semiconductor substrate to the electrode pad; an electrically conductive film covering an inner wall of the through hole, and electrically connected to the electrode pad; an electrically conductive adhesive disposed on a side of the second face of the semiconductor substrate, and electrically connected to the electrode pad via the electrically conductive film; a heat radiating member bonded to the second face of the semiconductor substrate with the electrically conductive adhesive; and a filling member with which the through hole is filled, the filling member being lower in coefficient of thermal expansion than the electrically conductive adhesive.

Abstract: A semiconductor device includes: a semiconductor substrate; an electrode pad disposed over a first face of the semiconductor substrate; a redistribution layer electrically connected to the electrode pad; a through hole disposed in the semiconductor substrate so as to extend from a second face opposite to the first face of the semiconductor substrate to the electrode pad; an electrically conductive film covering an inner wall of the through hole, and electrically connected to the electrode pad; an electrically conductive adhesive disposed on a side of the second face of the semiconductor substrate, and electrically connected to the electrode pad via the electrically conductive film; a heat radiating member bonded to the second face of the semiconductor substrate with the electrically conductive adhesive; and a filling member with which the through hole is filled, the filling member being lower in coefficient of thermal expansion than the electrically conductive adhesive.

Abstract: The present invention relates to a medicament for treating neuropsychiatric diseases, comprising a compound of Formula (1): or a pharmaceutically acceptable salt thereof, as an active ingredient.

Abstract: The present invention relates to a medicament for treating neuropsychiatric diseases, comprising a compound of Formula (1): or a pharmaceutically acceptable salt thereof, as an active ingredient.

Abstract: The present invention relates to a medicament for treating neuropsychiatric diseases, comprising a compound of Formula (1): or a pharmaceutically acceptable salt thereof, as an active ingredient.

Abstract: A wiring board includes a base board and a plurality of wiring layers formed of a resin insulating film on the base board, wherein at least one of the wiring layers includes a fine wiring, a barrier film, which is not in contact with the fine wiring, is formed at a more outer side from the base board than the wiring layer including the fine wiring, and different types of resin insulating films are used for a wiring layer at an inner side of the barrier film close to the base board and a wiring layer at an outer side of the barrier film, respectively.

Abstract: A wiring board includes a base board and a plurality of wiring layers formed of a resin insulating film on the base board, wherein at least one of the wiring layers includes a fine wiring, a barrier film, which is not in contact with the fine wiring, is formed at a more outer side than the base board than the wiring layer including the fine wiring, and different types of resin insulating films are used for a wiring layer at an inner side of the barrier film close to the base board and a wiring layer at an outer side of the barrier film, respectively.