Patents by Inventor Junya Komano

Junya Komano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molding packaging material and method for producing same
    Patent number: 10239287
    Abstract: A molding packaging material excellent in interlaminar lamination strength is provided, in which it is possible to prevent deterioration of the interlaminar strength due to influences of electrolytes and also possible to prevent deterioration of the interlaminar strength due to influences of heat generation and/or expansion/contraction of the packaging material caused by repetition of charging/discharging.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: March 26, 2019
    Assignees: SHOWA DENKO PACKAGING CO., LTD., TOAGOSEI CO., LTD.
    Inventors: Takahiro Ito, Junya Komano, Makoto Imahori, Tetsunobu Kuramoto, Yuuji Minamibori
  • MOLDING PACKAGING MATERIAL AND METHOD FOR PRODUCING SAME
    Publication number: 20150004476
    Abstract: A molding packaging material excellent in interlaminar lamination strength is provided, in which it is possible to prevent deterioration of the interlaminar strength due to influences of electrolytes and also possible to prevent deterioration of the interlaminar strength due to influences of heat generation and/or expansion/contraction of the packaging material caused by repetition of charging/discharging.
    Type: Application
    Filed: January 11, 2013
    Publication date: January 1, 2015
    Inventors: Takahiro Ito, Junya Komano, Makoto Imahori, Tetsunobu Kuramoto, Yuuji Minamibori