Abstract: Provided is a silicon-containing layer forming composition for forming a silicon-containing layer which exhibits an anti-reflective function during exposure in a multilayer resist process and, during dry etching, shows a high etching rate against a plasma of fluorine-based gas and a low etching rate against a plasma of oxygen-based gas. The silicon-containing layer forming composition includes a polysiloxane compound having a structural unit of the formula: [(R1)bR2mSiOn/2] and a solvent. In the formula, R1 is a group represented by the following formula: (where a is an integer of 1 to 5; and a wavy line means that a line which the wavy line intersects is a bond); R2 is each independently a hydrogen atom, a C1-C3 alkyl group, a phenyl group, a hydroxy group, a C1-C3 alkoxy group or a C1-C3 fluoroalkyl group; b is an integer of 1 to 3; m is an integer of 0 to 2; n is an integer of 1 to 3; and a relationship of b+m+n=4 is satisfied.

Abstract: Provided is a silicon-containing layer forming composition for forming a silicon-containing layer which exhibits an anti-reflective function during exposure in a multilayer resist process and, during dry etching, shows a high etching rate against a plasma of fluorine-based gas and a low etching rate against a plasma of oxygen-based gas. The silicon-containing layer forming composition includes a polysiloxane compound having a structural unit of the formula: [(R1)bR2mSiOn/2] and a solvent. In the formula, R1 is a group represented by the following formula: (where a is an integer of 1 to 5; and a wavy line means that a line which the wavy line intersects is a bond); R2 is each independently a hydrogen atom, a C1-C3 alkyl group, a phenyl group, a hydroxy group, a C1-C3 alkoxy group or a C1-C3 fluoroalkyl group; b is an integer of 1 to 3; m is an integer of 0 to 2; n is an integer of 1 to 3; and a relationship of b+m+n=4 is satisfied.

Abstract: Provided is a silicon-containing layer forming composition for forming a silicon-containing layer which exhibits an anti-reflective function during exposure in a multilayer resist process and, during dry etching, shows a high etching rate against a plasma of fluorine-based gas and a low etching rate against a plasma of oxygen-based gas. The silicon-containing layer forming composition includes a polysiloxane compound having a structural unit of the formula and a solvent. [(R1)bR2mSiOn/2] In the formula, R1 is a group represented by the following formula: (where a is an integer of 1 to 5; and a wavy line means that a line which the wavy line intersects is a bond); R2 is each independently a hydrogen atom, a C1-C3 alkyl group, a phenyl group, a hydroxy group, a C1-C3 alkoxy group or a C1-C3 fluoroalkyl group; b is an integer of 1 to 3; m is an integer of 0 to 2; n is an integer of 1 to 3; and a relationship of b+m+n=4 is satisfied).

Abstract: Provided is a polysiloxane composition containing a polysiloxane compound including a constitutional unit represented by Formula (1) and at least one of a constitutional unit of Formula (2) and a constitutional unit of Formula (3), and a solvent. [(Rx)bR1mSiOn/2]??(1) [(Ry)cR2pSiOq/2]??(2) [SiO4/2]??(3) Here, Rx is a monovalent group represented by Formula (1a) (X is a hydrogen atom or an acid-labile group, a is an integer of 1 to 5, and a broken line represents a bond), Ry is a monovalent organic group having 1 to 30 carbon atoms, which contains any one of an epoxy group, an oxetane group, an acryloyl group, and a methacryloyl group.

Abstract: Provided is a silicon-containing layer forming composition for forming a silicon-containing layer which exhibits an anti-reflective function during exposure in a multilayer resist process and, during dry etching, shows a high etching rate against a plasma of fluorine-based gas and a low etching rate against a plasma of oxygen-based gas. The silicon-containing layer forming composition includes a polysiloxane compound having a structural unit of the formula and a solvent. [(R1)bR2mSiOn/2] In the formula, R1 is a group represented by the following formula: (where a is an integer of 1 to 5; and a wavy line means that a line which the wavy line intersects is a bond); R2 is each independently a hydrogen atom, a C1-C3 alkyl group, a phenyl group, a hydroxy group, a C1-C3 alkoxy group or a C1-C3 fluoroalkyl group; b is an integer of 1 to 3; m is an integer of 0 to 2; n is an integer of 1 to 3; and a relationship of b+m+n=4 is satisfied.

Abstract: Provided is a production method for producing an aromatic alkoxysilane containing a hexafluoropropanol group (—C(CF3)2OH; referred to as HFIP group) from an inexpensive starting raw material with a high reaction conversion rate and selectivity. As shown in the following scheme, the production method includes: a first step of reacting an aromatic halosilane with hexafluoroacetone in the presence of a Lewis acid catalyst, thereby obtaining a HFIP group-containing aromatic halosilane; and a second step of forming the HFIP group-containing aromatic alkoxysilane by reacting the HFIP group-containing aromatic halosilane with an alcohol.

Abstract: Disclosed in the present invention are a fluorine-containing polymerizable compound of the general formula (1) and a polymer compound obtained therefrom: where A represents a single bond, an oxygen atom, a sulfur atom, SO2, CH2, CO, C(CH3)2, C(CH3)(CH2CH3), C(CF3)2, C(CH3)(C6H5), CH2—C6H4—CH2 or a divalent organic group obtained by elimination of two hydrogen atoms from benzene, biphenyl, naphtharene, cyclohexene or fluorene; and a and b each independently represent an integer of 0 to 2 and satisfy a relationship of 1?a+b?4. The thus-obtained polymer compound combines adequate hydrophilicity and high transparency with low water adsorption of fluorine-containing compound.

Abstract: A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent [(RX)bR1mSiOn/2]??(1) where RX represents the following group; R1 each represents a hydrogen atom, C1-C3 alkyl group, phenyl group, hydroxy group, C1-C3 alkoxy group or C1-C3 fluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.

Abstract: According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Abstract: A curable silicone resin composition according to the present invention includes at least the following components: (A) a silicone resin having a hydrogen atom bonded to silicon atom (as SiH group); (B) a silicone resin having a vinyl group bonded to silicon atom (as Si—CH?CH2 group); and (C) a platinum catalyst, wherein the total amount of silanol (Si—OH) group in the components (A) and (B) is 0.5 to 5.0 mmol/g; and wherein the amount of platinum in the component (C) relative to the total mass of the components (A), (B) and (C) is 0.003 to 3.0 ppm in mass units. A cured product obtained by heating the composition is suitably usable as an encapsulant of an optical semiconductor device.

Abstract: A composition provided to contain: an alkoxysilane condensate obtained by the condensation of alkoxysilane A represented by general formula (1): (CH3)Si(OR1)3 (In the general formula (1), R1 mutually independently represents methyl group or ethyl group.), alkoxysilane B represented by general formula (2): (Ph)Si(OR1)3 (In the general formula (2), R1 mutually independently represents methyl group or ethyl group.), and alkoxysilane C represented by general formula (3): (CH3)2Si(OR1)2 (In the general formula (3), R1 mutually independently represents methyl group or ethyl group.) at an A:B:C mole ratio within the range of 30-70:10-50:20-60; and a polyether-modified polydimethylsiloxane.

Abstract: Disclosed in the present invention are a fluorine-containing polymerizable compound of the general formula (1) and a polymer compound obtained therefrom: where A represents a single bond, an oxygen atom, a sulfur atom, SO2, CH2, CO, C(CH3)2, C(CH3)(CH2CH3), C(CF3)2, C(CH3)(C6H5), CH2—C6H4—CH2 or a divalent organic group obtained by elimination of two hydrogen atoms from benzene, biphenyl, naphtharene, cyclohexene or fluorene; and a and b each independently represent an integer of 0 to 2 and satisfy a relationship of 1?a+b?4. The thus-obtained polymer compound combines adequate hydrophilicity and high transparency with low water adsorption of fluorine-containing compound.

Abstract: Disclosed in the present invention are a fluorine-containing polymerizable compound of the general formula (1) and a polymer compound obtained therefrom: where A represents a single bond, an oxygen atom, a sulfur atom, SO2, CH2, CO, C(CH3)2, C(CH3)(CH2CH3), C(CF3)2, C(CH3)(C6H5), CH2—C6H4—CH2 or a divalent organic group obtained by elimination of two hydrogen atoms from benzene, biphenyl, naphthalene, cyclohexene or fluorene; and a and b each independently represent an integer of 0 to 2 and satisfy a relationship of 1?a+b?4. The thus-obtained polymer compound combines adequate hydrophilicity and high transparency with low water adsorption of fluorine-containing compound.

Abstract: Disclosed is a curable composition including a silicone (A) of a specific structure and a composition containing Si—OH group and Si—H group, a silicone (B) of a specific structure and a composition containing Si—OH group and Si—CH?CH2 group, and a hydrosilylation catalyst of a catalytic quantity containing at least one metal compound selected from the group consisting of platinum compounds, palladium compounds, and rhodium compounds. In this curable composition, as kind of each silicone and the content of Si—OH group are adjusted, in curing the silicone, foaming in a cured product can be inhibited by inhibiting a dehydration condensation reaction between Si—OH groups, as compared with a hydrosilylation reaction which is a reaction of Si—CH?CH2 group and Si—H group. Furthermore, an excellent adhesion to a base body such as semiconductor substrate can be given when making a cured film.

Abstract: A composition provided to contain: an alkoxysilane condensate obtained by the condensation of alkoxysilane A represented by general formula (1): (CH3)Si(OR1)3 (In the general formula (1), R1 mutually independently represents methyl group or ethyl group.), alkoxysilane B represented by general formula (2): (Ph)Si(OR1)3 (In the general formula (2), R1 mutually independently represents methyl group or ethyl group.), and alkoxysilane C represented by general formula (3): (CH3)2Si(OR1)2 (In the general formula (3), R1 mutually independently represents methyl group or ethyl group.) at an A:B:C mole ratio within the range of 30-70:10-50:20-60; and a polyether-modified polydimethylsiloxane.

Abstract: Disclosed is a novolak resin containing a repeating unit represented by the general formula (1). R1is a hydrogen atom or an alkyl group which is C1-4 straight-chain or C3-4 branched-chain, and some or all hydrogen atoms in the alkyl group may be replaced with a fluorine atom; R2 is a hydrogen atom, a phenyl group, an alkyl group which is C1-10 straight-chain or C3-10 branched-chain, or an alkyl group having a C3-10 cyclic structure, and some or all hydrogen atoms in the phenyl group and the alkyl group may be replaced with fluorine atoms; each of a and b is independently an integer of 1-3, and these are defined as 2?a+b?4; and d is an integer of 0-2. This novolak resin has high dissolution rate in the alkaline development solution in addition to the heat resisting property which is a property of phenolic resin.

Abstract: A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent [(RX)bR1mSiOn/2]??(1) where RX represents the following group; R1 each represents a hydrogen atom, C1-C3 alkyl group, phenyl group, hydroxy group, C1-C3 alkoxy group or C1-C3 fluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.

Abstract: A composition provided to contain: an alkoxysilane condensate obtained by the condensation of alkoxysilane A represented by general formula (1): (CH3)Si(OR1)3 (In the general formula (1), R1 mutually independently represents methyl group or ethyl group.), alkoxysilane B represented by general formula (2): (Ph)Si(OR1)3 (In the general formula (2), R1 mutually independently represents methyl group or ethyl group.), and alkoxysilane C represented by general formula (3): (CH3)2Si(OR1)2 (In the general formula (3), R1 mutually independently represents methyl group or ethyl group.) at an A:B:C mole ratio within the range of 30-70:10-50:20-60; and a polyether-modified polydimethylsiloxane.

Abstract: According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Abstract: Disclosed is a novolak resin containing a repeating unit represented by the general formula (1). R1is a hydrogen atom or an alkyl group which is C1-4 straight-chain or C3-4 branched-chain, and some or all hydrogen atoms in the alkyl group may be replaced with a fluorine atom; R2 is a hydrogen atom, a phenyl group, an alkyl group which is C1-10 straight-chain or C3-10 branched-chain, or an alkyl group having a C3-10 cyclic structure, and some or all hydrogen atoms in the phenyl group and the alkyl group may be replaced with fluorine atoms; each of a and b is independently an integer of 1-3, and these are defined as 2?a+b?4; and d is an integer of 0-2. This novolak resin has high dissolution rate in the alkaline development solution in addition to the heat resisting property which is a property of phenolic resin.