Abstract: A method for fabricating a small and low-profile surface acoustic wave device which can be formed collectively by a wafer process without causing deterioration in characteristics is provided. The surface acoustic wave device has a piezoelectric substrate 1, an IDT 2 formed on one major surface of the piezoelectric substrate 1 and having at least one comb-shaped electrode, and a protective cover 6 forming a hollow containing space 7 with the one major surface by covering the IDT 2 above the one major surface. The protective cover 6 is provide with a through hole 15 and composed, at least partially, of a photocurable material containing an acid generator which contains fluorine.