Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

Abstract: Based on a result of repeated analysis of stress caused by application of an external impact in a circuit board, which is rectangular or substantially rectangular in plan view and includes mounting electrodes, included in an electronic component, the mounting electrodes near four corners of the circuit board, of the mounting electrodes provided on a back surface of the circuit board included in the electronic component, are provided at positions shifted from diagonal lines of the back surface. Hence, the stress produced near the four corners of the circuit board is reduced, and this can effectively prevent a fracture, a chip, and a crack from being caused in the circuit board.

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

Abstract: A module includes a substrate including an IC disposed on an upper surface side thereof. The IC includes a modulation circuit unit arranged to modulate a baseband signal into an RF signal and a demodulation circuit unit arranged to demodulate an RF signal into a baseband signal. The substrate includes a first wiring layer provided on the upper surface side, a second wiring layer disposed on a lower surface side of the first wiring layer, and an insulator layer disposed between the first wiring layer and the second wiring layer. A baseband signal-use wiring pattern is provided in the first wiring layer, an RF signal-use wiring pattern is provided in the second wiring layer, and on one surface of the insulator layer, a substantially flat-plate ground electrode pattern is arranged to cover substantially an entire surface. A balun is provided in the second wiring layer.

Abstract: Based on a result of repeated analysis of stress caused by application of an external impact in a circuit board, which is rectangular or substantially rectangular in plan view and includes mounting electrodes, included in an electronic component, the mounting electrodes near four corners of the circuit board, of the mounting electrodes provided on a back surface of the circuit board included in the electronic component, are provided at positions shifted from diagonal lines of the back surface. Hence, the stress produced near the four corners of the circuit board is reduced, and this can effectively prevent a fracture, a chip, and a crack from being caused in the circuit board.

Abstract: A module includes a substrate including an IC disposed on an upper surface side thereof. The IC includes a modulation circuit unit arranged to modulate a baseband signal into an RF signal and a demodulation circuit unit arranged to demodulate an RF signal into a baseband signal. The substrate includes a first wiring layer provided on the upper surface side, a second wiring layer disposed on a lower surface side of the first wiring layer, and an insulator layer disposed between the first wiring layer and the second wiring layer. A baseband signal-use wiring pattern is provided in the first wiring layer, an RF signal-use wiring pattern is provided in the second wiring layer, and on one surface of the insulator layer, a substantially flat-plate ground electrode pattern is arranged to cover substantially an entire surface.

Abstract: An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate.

Abstract: An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate.