Patents by Inventor Junya Yamada

Junya Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240181525
    Abstract: The powder material for additive manufacturing disclosed herein includes tungsten carbide (WC), cobalt (Co), and a carbon additive including carbon (C) as a main constituent element, and the value of a carbon content A (% by mass), which is represented by the following formula: [(mass of C derived from WC)+(mass of C derived from carbon additive)]/(mass of WC)×100, satisfies the condition of 6.4?A?7.2.
    Type: Application
    Filed: March 23, 2022
    Publication date: June 6, 2024
    Applicant: FUJIMI INCORPORATED
    Inventors: Junya YAMADA, Hiroyuki IBE, Yuta KATO
  • Publication number: 20240146494
    Abstract: [Object] Transmission efficiency is improved while transmission latency is minimized as possible. [Solving Means] A communication apparatus includes a communication section configured to count an interval allocated in a TDD (Time Division Duplex) mode as one TDD time slot, with a plurality of the TDD time slots counted as one period, the communication section further transmitting periodically, to a communication partner apparatus, multiple application packets corresponding to multiple serial signals generated by multiple applications, and a transmission control section configured to provide, from among the multiple TDD time slots, at least one specific TDD time slot for transmitting a limited portion of the application packets corresponding to at least two of the multiple applications, the transmission control section further shifting, in each period, priorities of the limited portion of the application packets to be transmitted in the specific TDD time slot.
    Type: Application
    Filed: February 18, 2022
    Publication date: May 2, 2024
    Inventors: Toshihisa Hyakudai, Satoshi Ota, Junya Yamada
  • Publication number: 20240139771
    Abstract: A functional film 1 according to an embodiment includes: a substrate (10) containing an acetyl cellulose resin; a primer layer (20) containing a filler (40) and disposed on the substrate (10); and a functional layer (30) containing the filler (40) and disposed on the primer layer (20). The substrate (10) has a permeation layer (12) formed by permeation of the resin contained in the primer layer (20) into part of the substrate (10). The permeation layer (12) has a thickness of 0.1 ?m or more and 3.5 ?m or less. The primer layer (20) has a thickness of 0.1 ?m or more and 1.0 ?m or less. The filler (40) is silica particles having an average particle size of 20 nm or more and 80 nm or less. The filler (40) in the primer layer (20) has a density of ? or more and ¾ or less of the density of the filler (40) in the functional layer (30). The primer layer (20) and the functional layer (30) each contain a resin. The resin component of the primer layer (20) is the same as the resin component of the functional layer 30.
    Type: Application
    Filed: June 10, 2022
    Publication date: May 2, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Ryuji HASHIMOTO, Toshihito SHIMIZU, Junya YAMADA
  • Patent number: 11971842
    Abstract: A communication device includes a communication unit configured to transmit a serial signal group conforming to a serial peripheral interface (SPI) and transmitted from a master in synchronization with a clock to a communication partner device as a batch of data blocks within one frame period of a predetermined communication protocol, or transmit the serial signal group to the communication partner device as a plurality of data blocks divided according to a plurality of frame periods.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: April 30, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Patent number: 11960434
    Abstract: A communication device includes: a communication unit that adds, to a set of data blocks including a serial signal group conforming to SPI transmitted from a master in synchronization with a clock, identification information for identifying the data blocks, and transmits the data blocks to a communication partner device within one frame period of a predetermined communication protocol, or adds, to data blocks each including a part of the serial signal group, identification information for identifying each of the data blocks, and transmits the data blocks to the communication partner device in a plurality of frame periods; and a storage unit that sequentially stores a predetermined number of data blocks transmitted from the master and outputs a data block transmitted from the communication partner device in response to the predetermined number of data blocks from the master and stored, to transmit the data block to the master.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: April 16, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Publication number: 20240103937
    Abstract: An information processing apparatus includes a processor. For each of applications, a device necessary to display a screen for the application and a device necessary to execute the application are defined. The processor is configured to activate an application if a device necessary to display a screen for the application has been restored in a case where an instruction to activate the application is given after an operation for turning on the information processing apparatus is performed.
    Type: Application
    Filed: March 13, 2023
    Publication date: March 28, 2024
    Applicant: FUJIFILM BUSINESS INNOVATION CORP.
    Inventor: Junya YAMADA
  • Publication number: 20240089074
    Abstract: Communication apparatus with correct audio signal regeneration are disclosed. In one example, a communication apparatus includes a counter that counts the number of a predetermined reference clock included in one cycle of a divided signal of an audio master clock with a frequency that is equal to a product of a frequency of a sampling clock for sampling of an audio signal and a multiplier on the basis of the audio master clock, a ratio of division of the divided signal and the predetermined reference clock. A packet generator generates a packet including the counted number counted, a bit width of SD (Serial Data) conforming to an I2S standard, the frequency of the sampling clock, the ratio of division of the divided signal to the audio master clock, a frequency ratio of the frequency of the audio master clock to the frequency of the sampling clock, and the SD.
    Type: Application
    Filed: February 3, 2022
    Publication date: March 14, 2024
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Publication number: 20240078210
    Abstract: [Object] To perform serial communication at high speed by combining different communication methods with each other. [Solving Means] A communication apparatus includes a communicating unit configured to add identification information identifying a data block to one set of the data block including a serial signal group, the serial signal group being transmitted from a master in synchronism with a clock and complying with SPI (Serial Peripheral Interface), and transmit the one set of the data block to a communication partner apparatus within one frame period of a predetermined communication protocol, or add identification information identifying each of multiple data blocks to the multiple data blocks each including a part of the serial signal group and transmit the multiple data blocks to the communication partner apparatus in multiple frame periods.
    Type: Application
    Filed: February 3, 2022
    Publication date: March 7, 2024
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Patent number: 11923447
    Abstract: A semiconductor device includes a substrate, an insulating layer provided over the substrate, a collection of metal particles exposed on the surface of the insulating layer, and a diamond layer provided on the surface of the insulating layer on which the metal particles are exposed. By controlling the surface density and particle size of the metal particles on the surface of the insulating layer, the surface density of diamond nuclei that are formed on the surface is controlled. Diamond grains are formed by crystal growth using the diamond nuclei as starting material, thereby forming a diamond layer. The control of the surface density of the diamond nuclei results in forming, by the crystal growth, the diamond grains with a grain size exhibiting a relatively high thermal conductivity in the crystal growth initial layer of the diamond layer and improving the thermal conductivity between the diamond layer and the substrate.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: March 5, 2024
    Assignee: FUJITSU LIMITED
    Inventors: Junya Yaita, Atsushi Yamada
  • Publication number: 20240038817
    Abstract: An image pickup unit includes a stacked device in a substantially rectangular parallelepiped shape including an external electrode, and a three-dimensional wiring board including a bonding electrode and an alignment mark on a bottom surface of a recess on a first principal surface and a projection, on a side surface, projecting in a first direction parallel to a wall surface of the recess, in which the external electrode of the stacked device that is disposed in the recess is bonded to the bonding electrode, and on the bottom surface, an area of a region in which a first region where the bonding electrode is virtually moved in the first direction and the alignment mark are superposed on each other is less than 50% of an area of the alignment mark.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 1, 2024
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Junya YAMADA
  • Publication number: 20240040224
    Abstract: An image pickup unit includes: a three-dimensional wiring board including a recess on a first principal surface, in which a wall surface of the recess has an inclination angle of an upper region that is smaller than an inclination angle of a lower region; a stacked device disposed in the recess, the stacked device including an optical system and an image pickup device; and resin disposed in a gap between the recess and the stacked device.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 1, 2024
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Junya YAMADA
  • Patent number: 11863500
    Abstract: A communication apparatus includes: a communication unit that periodically transmits, with an interval assigned by TDD (Time Division Duplex) being one TDD time slot and a plurality of TDD time slots being one period, a plurality of application packets corresponding to a plurality of serial signals generated by a plurality of applications to a communication partner device; and a transmission control unit that changes, for every one period, a priority of part of application packets corresponding to part of two or more applications of the plurality of applications, the part of application packets being transmitted in at least one specific TDD time slot for transmitting the part of application packets, the plurality of TDD time slots including the at least one specific TDD time slot.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: January 2, 2024
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Satoshi Ota, Junya Yamada
  • Publication number: 20230414065
    Abstract: An endoscope system includes a first processor and a second processor. The first processor is configured to receive an information including a number of times an endoscope is used, and determine if the number of times the endoscope is used is equal to or larger than a predetermined number of times. The second processor is configured to overwrite a first image correction data with a second image correction data when the first processor determines the number of times the endoscope is used is equal to or larger than the predetermined number of times.
    Type: Application
    Filed: June 21, 2023
    Publication date: December 28, 2023
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Junya YAMADA
  • Publication number: 20230385225
    Abstract: The memory capacity for storing address information etc. of an I2C communication instrument, as well as the number of encoders and decoders can be reduced. A communication device to establish communication between a first I2C communication instrument and a second I2C communication instrument connected to a communication partner device, includes: an encoder that generates Header Packet Data including a target ID of the communication partner device and I2C Packet Data including a slave address and an offset address of the second I2C communication instrument; a communication unit that transmits a transmission packet including the Header Packet Data and the I2C Packet Data generated by the encoder to the communication partner device by a TDD communication scheme and receives a reception packet from the communication partner device by the TDD communication scheme; and a decoder that generates the I2C Packet Data from the reception packet.
    Type: Application
    Filed: May 19, 2023
    Publication date: November 30, 2023
    Inventors: Junya Yamada, Toshihisa Hyakudai, Satoshi Ota
  • Patent number: 11831739
    Abstract: A communication apparatus includes: a LINK for performing protocol-conversion on a signal from a Master and outputting the converted signal to a Slave SerDes and for performing protocol-conversion on a signal from the Slave SerDes and outputting the converted signal to the Master, the LINK being capable of alternatively selecting a first mode and a second mode when transmitting the signal from the Master to the Slave SerDes, in the first mode, the LINK converting the signal transmitted from the Master into a signal of a first communication standard in units of one byte, receiving a signal of the first communication standard including one of an ACK signal representing an affirmative response and a NACK signal representing a negative response after transmitting the converted signal to the Slave SerDes, converting the received signal into a signal of a second communication standard, and transmitting the converted signal to the Master.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: November 28, 2023
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Junya Yamada, Satoshi Ota, Toshihisa Hyakudai
  • Publication number: 20230344552
    Abstract: To solve a problem related to error correction. A communication apparatus includes: a PHY that receives a first transmission signal conforming to a predetermined communication protocol from a communication partner apparatus and performs error correction on a plurality of first packets included in the first transmission signal; and a LINK that separates the plurality of first packets after error correction and generates a second packet including error correction impossible information of the first packet on which the error correction has not been correctly performed, and the PHY transmits a second transmission signal including the second packet to the communication partner apparatus.
    Type: Application
    Filed: January 24, 2023
    Publication date: October 26, 2023
    Inventors: Junya Yamada, Toshihisa Hyakudai, Satoshi Ota
  • Publication number: 20230294349
    Abstract: A forming system includes a trim blade 7 for cutting off a sheet material 2 provided between a lower die 60 and an upper die 66, a first lower plate 81 provided outside a first lower die end 60a in a side view of the lower die 60, and a first upper plate 85 provided outside an upper die end 66a, configured to reciprocatively move together with the upper die 66 and extending toward the first lower plate 81. A cut plane of the blade 7 intersects a first excess edge portion 25 which is a portion of the sheet material 2 outside the lower die end 60a, and at least a portion of the excess edge portion 25 is sandwiched between the first lower plate 81 and the first upper plate 85 in a state in which the lower die 60 and the upper die 66 are clamped.
    Type: Application
    Filed: February 28, 2023
    Publication date: September 21, 2023
    Inventors: Yuki KAWADA, Junya YAMADA
  • Patent number: 11743024
    Abstract: Communication devices and systems with correct regeneration of an audio signal are disclosed. In one example, a communication device measures a number of predetermined reference clocks included in one cycle of a frequency divided signal, on the basis of an audio master clock having a frequency obtained by multiplying a frequency of a sampling clock to sample an audio signal, a frequency division ratio of a frequency divided signal of the audio master clock, and a predetermined reference clock. A packet generator generates a packet including information including the measured number, a bit width of serial data (SD) conforming to an Inter-IC Sound (I2S) standard, the frequency of the sampling clock, a frequency division ratio of the frequency divided signal to the audio master clock, a frequency ratio of the frequency of the audio master clock to the frequency of the sampling clock, and the SD.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: August 29, 2023
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Patent number: 11739396
    Abstract: To provide a powder material for additive layer manufacturing capable of molding a three-dimensional shaped molded article having less cracking or chipping and having high hardness and a method for manufacturing a molded article using the powder material. A powder material for additive layer manufacturing used to manufacture a three-dimensional shaped molded article by irradiation with a laser light or an electron beam contains cobalt, a first component containing one or more substances selected from the group consisting of vanadium carbide, niobium carbide, and molybdenum carbide, an optional additive component, and the balance of tungsten carbide. The content of the first component is 0.6% by mass or more and 5% by mass or less.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: August 29, 2023
    Assignee: FUJIMI INCORPORATED
    Inventors: Nobuaki Kato, Hiroyuki Ibe, Junya Yamada
  • Publication number: 20230269062
    Abstract: Communication apparatus and systems are disclosed. In one example, a communication apparatus, which sends and receives information to and from a communication partner apparatus alternately within a period allocated by a TDD communication scheme, includes a PHY, a LINK, decoders and encoders. The PHY receives a first transmission signal conforming to a predetermined communication protocol from the communication partner apparatus, performs error correction on first packets therein, and sends a second transmission signal to the communication partner apparatus. The LINK separates the first packets and aggregates second packets included in the second transmission signal to send the aggregated second packets to the PHY. The decoders decode the first packets. The encoders generate the second packets. The PHY stores error information regarding each of the decoders and the encoders, and includes an operation-administration-maintenance (OAM) unit that includes the error information in one of the second packets.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 24, 2023
    Inventors: Junya Yamada, Toshihisa Hyakudai, Satoshi Ota