Patents by Inventor Junya Yamada

Junya Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260161126
    Abstract: An information processing system includes a processor configured to acquire and record, for each unit of a management target apparatus, management information for managing a remaining life of the unit, the management information including remaining life determination information for determining a remaining life of each component in the unit.
    Type: Application
    Filed: April 23, 2025
    Publication date: June 11, 2026
    Applicant: FUJIFILM Business Innovation Corp.
    Inventor: Junya YAMADA
  • Publication number: 20260129988
    Abstract: An image pickup module includes a wiring board including a first principal surface and a second principal surface, a land and a draw-out wiring being disposed on the first principal surface, the wiring board including a through hole, a through wiring layer in electrical communication with the draw-out wiring being disposed on an inner surface of the through hole; a resin disposed in the through hole and sealing an opening on a side of the first principal surface; a bonding member bonded to the land; and a camera unit bonded to the bonding members.
    Type: Application
    Filed: December 4, 2025
    Publication date: May 7, 2026
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventors: Keiichi KOBAYASHI, Daichi KODAMA, Junya YAMADA
  • Publication number: 20260108941
    Abstract: Provided is a technology that allows reduction in risk of dispersion of a powder material by application of energy in a process of additive manufacturing. The powder material for additive manufacturing disclosed herein contains a first material constituted with ceramics, and a second material constituted with at least one of magnesium (Mg), zinc (Zn), molybdenum (Mo), tungsten (W), copper (Cu), aluminum (Al), carbon (C), and silicon (Si). The powder material is constituted with composite particles including a mixture of the first material and the second material.
    Type: Application
    Filed: August 25, 2023
    Publication date: April 23, 2026
    Applicant: FUJIMI INCORPORATED
    Inventors: Junya YAMADA, Nobuaki KATO, Yuta KATO
  • Patent number: 12569115
    Abstract: An endoscope system includes a first processor and a second processor. The first processor is configured to receive an information including a number of times an endoscope is used, and determine if the number of times the endoscope is used is equal to or larger than a predetermined number of times. The second processor is configured to overwrite a first image correction data with a second image correction data when the first processor determines the number of times the endoscope is used is equal to or larger than the predetermined number of times.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: March 10, 2026
    Assignee: Olympus Medical Systems Corp.
    Inventor: Junya Yamada
  • Publication number: 20260030195
    Abstract: High-speed data transmission is disclosed. In one example, a communication device receives control data from a master device, the control data including first data of a first format according to a first protocol to be transmitted from a communication partner device to an image sensor. The first data is stored, and is converted into second data of a second format different from the first format according to a second protocol different from the first protocol. The second data is transmitted to the communication partner device. The second data is configured for conversion into third data according to the first protocol, for transmission to the image sensor.
    Type: Application
    Filed: July 24, 2024
    Publication date: January 29, 2026
    Inventors: Toshihisa Hyakudai, Junya Yamada
  • Publication number: 20260025564
    Abstract: An image pickup unit includes: a three-dimensional wiring board including a recess on a first principal surface, in which a wall surface of the recess has an inclination angle of an upper region that is smaller than an inclination angle of a lower region; a stacked device disposed in the recess, the stacked device including an optical system and an image pickup device; and resin disposed in a gap between the recess and the stacked device.
    Type: Application
    Filed: October 1, 2025
    Publication date: January 22, 2026
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Junya YAMADA
  • Patent number: 12479005
    Abstract: A functional film 1 according to an embodiment includes: a substrate (10) containing an acetyl cellulose resin; a primer layer (20) containing a filler (40) and disposed on the substrate (10); and a functional layer (30) containing the filler (40) and disposed on the primer layer (20). The substrate (10) has a permeation layer (12) formed by permeation of the resin contained in the primer layer (20) into part of the substrate (10). The permeation layer (12) has a thickness of 0.1 ?m or more and 3.5 ?m or less. The primer layer (20) has a thickness of 0.1 ?m or more and 1.0 ?m or less. The filler (40) is silica particles having an average particle size of 20 nm or more and 80 nm or less. The filler (40) in the primer layer (20) has a density of ? or more and ¾ or less of the density of the filler (40) in the functional layer (30). The primer layer (20) and the functional layer (30) each contain a resin. The resin component of the primer layer (20) is the same as the resin component of the functional layer 30.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: November 25, 2025
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Ryuji Hashimoto, Toshihito Shimizu, Junya Yamada
  • Publication number: 20250355828
    Abstract: The memory capacity for storing address information etc. of an I2C communication instrument, as well as the number of encoders and decoders can be reduced. A communication device to establish communication between a first I2C communication instrument and a second I2C communication instrument connected to a communication partner device, includes: an encoder that generates Header Packet Data including a target ID of the communication partner device and I2C Packet Data including a slave address and an offset address of the second I2C communication instrument; a communication unit that transmits a transmission packet including the Header Packet Data and the I2C Packet Data generated by the encoder to the communication partner device by a TDD communication scheme and receives a reception packet from the communication partner device by the TDD communication scheme; and a decoder that generates the I2C Packet Data from the reception packet.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 20, 2025
    Inventors: Junya Yamada, Toshihisa Hyakudai, Satoshi Ota
  • Publication number: 20250339875
    Abstract: A functional film includes: an acetyl cellulose resin substrate; a primer layer containing a filler and disposed on the substrate; and a functional layer containing the filler and disposed on the primer layer. The substrate has a permeation layer formed by permeation of the resin contained in the primer layer into part of the substrate. The permeation layer has a thickness of 0.1 ?m-3.5 ?m. The primer layer has a thickness of 0.1 ?m-1.0 ?m. The filler is silica particles having an average particle size of 20 nm-80 nm. The filler in the primer layer has a density of ?-¾ of the density of the filler in the functional layer. The primer layer and the functional layer each contain a resin. The resin component of the primer layer is the same as the resin component of the functional layer.
    Type: Application
    Filed: July 18, 2025
    Publication date: November 6, 2025
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Ryuji HASHIMOTO, Toshihito SHIMIZU, Junya YAMADA
  • Patent number: 12457089
    Abstract: Communication apparatus with correct audio signal regeneration are disclosed. In one example, a communication apparatus includes a counter that counts the number of a predetermined reference clock included in one cycle of a divided signal of an audio master clock with a frequency that is equal to a product of a frequency of a sampling clock for sampling of an audio signal and a multiplier on the basis of the audio master clock, a ratio of division of the divided signal and the predetermined reference clock. A packet generator generates a packet including the counted number counted, a bit width of SD (Serial Data) conforming to an I2S standard, the frequency of the sampling clock, the ratio of division of the divided signal to the audio master clock, a frequency ratio of the frequency of the audio master clock to the frequency of the sampling clock, and the SD.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: October 28, 2025
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Patent number: 12447533
    Abstract: There is provided a powder material that is for manufacturing a molded article having low porosity and having uniformly present micropores by an additive layer manufacturing method. A powder material for use in additive layer manufacturing contains ceramics and metals, in which a tapped filling rate defined by (tapped density/theoretical density)×100% is 30% or more and less than 40%.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: October 21, 2025
    Assignee: FUJIMI INCORPORATED
    Inventors: Junya Yamada, Hiroyuki Ibe, Nobuaki Kato, Yuta Kato, Yoshikazu Sugiyama
  • Patent number: 12452513
    Abstract: An image pickup unit includes: a three-dimensional wiring board including a recess on a first principal surface, in which a wall surface of the recess has an inclination angle of an upper region that is smaller than an inclination angle of a lower region; a stacked device disposed in the recess, the stacked device including an optical system and an image pickup device; and resin disposed in a gap between the recess and the stacked device.
    Type: Grant
    Filed: October 12, 2023
    Date of Patent: October 21, 2025
    Assignee: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Junya Yamada
  • Patent number: 12445539
    Abstract: In one example, a communication device includes a LINK that generates a first output signal on a basis of a first external signal from a first external device, outputs the first output signal to a second external device, generates a second output signal on a basis of a second external signal from the second external device, and outputs the second output signal to the first external device, in which each of the first output signal and the second external signal includes command information indicating content of a command transmitted from the first external device, final-destination-device-identification-information for identifying a final destination device of data transmitted from the first external device, internal address information indicating an internal address of the final destination device, data length information indicating a length of the data transmitted from the first external device, and data-end-position-information indicating an end position of the data transmitted.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: October 14, 2025
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Takayuki Hirama, Junya Yamada, Hiroo Takahashi, Toshihisa Hyakudai
  • Patent number: 12425495
    Abstract: Communication devices and systems are disclosed. In one example, a communication device includes a LINK that performs protocol conversion of a signal from a Master and outputs the converted signal to a Slave SerDes, and of a signal from the Slave SerDes and outputs the converted signal to the Master. The LINK alternatively selects a first mode and a second mode. In the first mode, the LINK converts a 1-byte signal transmitted from the Master into a signal of a first communication standard in units of the 1-byte signal and transmits the converted signal to the Slave SerDes, then receives a signal of the first communication standard including an ACK signal representing an acknowledgement or a NACK signal representing a negative acknowledgement, and converts the received signal into a signal of a second communication standard and transmits the converted signal to the Master.
    Type: Grant
    Filed: May 14, 2024
    Date of Patent: September 23, 2025
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Junya Yamada, Satoshi Ota, Toshihisa Hyakudai
  • Patent number: 12420471
    Abstract: A forming system includes a trim blade 7 for cutting off a sheet material 2 provided between a lower die 60 and an upper die 66, a first lower plate 81 provided outside a first lower die end 60a in a side view of the lower die 60, and a first upper plate 85 provided outside an upper die end 66a, configured to reciprocatively move together with the upper die 66 and extending toward the first lower plate 81. A cut plane of the blade 7 intersects a first excess edge portion 25 which is a portion of the sheet material 2 outside the lower die end 60a, and at least a portion of the excess edge portion 25 is sandwiched between the first lower plate 81 and the first upper plate 85 in a state in which the lower die 60 and the upper die 66 are clamped.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: September 23, 2025
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yuki Kawada, Junya Yamada
  • Patent number: 12413327
    Abstract: A communication apparatus includes: an encoder that generates a packet of a time division duplex (TDD) communication system, the packet including a high-definition multimedia interface (HDMI) signal; and a communication unit that transmits the packet to a communication partner device for each of a plurality of divided periods obtained by dividing one TDD burst period in the TDD communication system.
    Type: Grant
    Filed: January 24, 2023
    Date of Patent: September 9, 2025
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Satoshi Ota, Junya Yamada
  • Patent number: 12393546
    Abstract: Communication devices, systems and methods are disclosed. In one example, a communication device includes: a communication unit that adds identification information for identifying a data block to a set of data blocks having a serial signal group conforming to SPI transmitted from a master in synchronization with a clock, and transmits the data block to a communication partner device within one frame period of a predetermined communication protocol, or adds identification information for identifying each of the data blocks, and transmits the data block to the communication partner device in a plurality of frame periods; and a storage unit that sequentially stores a number of data blocks transmitted from the master, and then outputs a data block transmitted from the communication partner device in response to the number of data blocks, to transmit the data block to the master.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: August 19, 2025
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshihisa Hyakudai, Junya Yamada, Satoshi Ota
  • Publication number: 20250261471
    Abstract: An image pickup unit, which is an electronic component device, includes: a stacked device which is an electronic component including an external electrode; and a wiring board. The wiring board has a first principal surface and includes a bonding electrode and an alignment mark on the first principal surface, the external electrode of the electronic component is bonded to the bonding electrode, and on the first principal surface, an area of a region in which a first region where the bonding electrode is virtually moved in a predetermined first direction, and the alignment mark are superimposed on each other is less than 50% of an area of the alignment mark.
    Type: Application
    Filed: April 29, 2025
    Publication date: August 14, 2025
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Junya YAMADA
  • Publication number: 20250235091
    Abstract: In an insertion potion for use with an endoscope comprises a frame disposed in a distal end portion of the insertion portion; a three-dimensional wiring board fixed to the frame; and a camera. The three-dimensional wiring board comprises a first surface, a second surface arranged distally relative to the first surface, and a third surface arranged proximally relative to the first surface. The camera is mounted on the first surface inclined at a first angle relative to a longitudinal direction of the distal end portion. The frame includes a fourth surface contacting the second surface and a fifth surface contacting the third surface.
    Type: Application
    Filed: January 16, 2025
    Publication date: July 24, 2025
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventor: Junya YAMADA
  • Publication number: 20250211845
    Abstract: An electronic device includes: a circuit device having a specific region including two conductors formed on a surface of the circuit device to be spaced apart from each other by a first distance in a first direction and to have substantially equal widths in the first direction, and at least two solderless portions arranged to be spaced apart from each other by a second distance in a second direction intersecting the first direction and to intersect the two conductors; and an electronic component including two electrodes soldered to the two conductors, respectively, between the at least two solderless portions.
    Type: Application
    Filed: March 7, 2025
    Publication date: June 26, 2025
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventors: Yo ASAKURA, Junya YAMADA