Patents by Inventor Junyan LU

Junyan LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130202
    Abstract: A display panel includes an active area and a peripheral area surrounding the active area, and the display panel further includes: a substrate and a plurality of light emitting devices arranged on the substrate in array, wherein the plurality of light emitting devices are located at least in the active area; a conducting layer comprising a cathode ring and cathodes of the plurality of light emitting devices, wherein the cathode ring is located in the peripheral area, and the cathode ring surrounds the active area; and a lens layer located at a side of the light emitting devices away from the substrate, wherein the lens layer extends from the active area to the peripheral area; wherein an orthographic projection of the lens layer on the substrate is located within an area delineated by an outer contour of an orthographic projection of the cathode ring on the substrate.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Applicants: Yunnan Invensight Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Chao Pu, Shengji Yang, Junyan Yang, Xiaochuan Chen, Kuanta Huang, Pengcheng Lu, Dachao Li, Rongrong Shi, Junbo Wei, Xiao Bai, Bo Yang
  • Publication number: 20160074373
    Abstract: Compositions and methods concern organic molecules that bind to human Atox1 and CCS at the copper trafficking interface of these proteins. This binding suppresses copper trafficking, which leads to inhibition of cancer cell proliferation and tumor growth. In addition to serving as an effective treatment of cancer, these organic molecules inhibit cellular copper uptake and can be used as treatment of disorders of copper metabolism such as Wilson's disease, which is characterized by copper overload, as well as wound healing.
    Type: Application
    Filed: January 23, 2014
    Publication date: March 17, 2016
    Applicants: The University of Chicago, Shanghai Institute of Materia Medica, Chinese Academy of Sciences
    Inventors: Chuan HE, Jing WANG, Hualiang JIANG, Cheng LUO, Hong LIU, Junyan LU