Patents by Inventor Jun-Yi Lee

Jun-Yi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240077586
    Abstract: A method for processing point data obtained from a light detection and ranging (LiDAR) device is proposed. The method may include obtaining point cloud data including a plurality of point data for a plurality of detection points. The method may also include generating an image of the plurality of detection points based on the point cloud data. Each of the plurality of point data may include location information about a detection point and a geometrically enhanced intensity of the detection point. The geometrically enhanced intensity may be generated based on a combination of a reflection parameter related to the amount of light scattered at the detection point and a geometric parameter based on geometrical characteristic of the detection point.
    Type: Application
    Filed: January 28, 2022
    Publication date: March 7, 2024
    Inventors: Yong Yi LEE, Junho CHOI, Dongwon SHIN, Deokyun JANG, Jun Hwan JANG
  • Patent number: 11920238
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Patent number: 6514861
    Abstract: A semiconductor process for manufacturing a wafer. First, a previously predicted process rate and a previously measured process rate are provided by a process tool. Next, a presently predicted process rate is obtained by a first linear equation having a first variable weighting factor using the previously predicted process rate and the previously measured process rate as variables. Next, a process time is obtained according to the presently predicted process rate and a predetermined process target to input to the process tool. Finally, the wafer is manufactured according to the process time by the process tool.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: February 4, 2003
    Assignee: ProMOS Technologies Inc.
    Inventors: Ming-Cheng Yang, Jun-Yi Lee, Yun-Yu Chan, Sheng-Tsaing Tseng