Patents by Inventor Jun-Ying Lu

Jun-Ying Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED chip array module
    Patent number: 7683475
    Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: March 23, 2010
    Assignee: Dicon Fiberoptics, Inc.
    Inventors: Ho-Shang Lee, Jun-Ying Lu
  • LED chip array module
    Publication number: 20070235863
    Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 11, 2007
    Applicant: DiCon Fiberoptics, Inc.
    Inventors: Ho-Shang Lee, Jun-Ying Lu