Abstract: A method, computer program product, and computer system for processing instances of message sequences. Two or more instances are received. Each instance has an instance number and an associated instance Id. Each instance includes a stream of one or more messages. Each message in each stream is associated with a respective task. All messages in the two or more instances whose respective tasks have been completed are distributed into partitions in the broker. Different messages in each instance of at least one instance are distributed into different partitions. The messages distributed in the partitions include parallel task messages. The parallel task messages are sequenced by being grouped by the instance number or instance Id and are sequentially ordered in each group in an ascending order of a timestamp of arrival of each parallel task message at the broker. The parallel task messages in each instance are dispatched to a service.

Abstract: Described are techniques for using a dynamic ensemble model. The techniques including training a plurality of machine learning models on training data. The techniques further include identifying a similar subset of the training data that is similar to a dataset for evaluation. The techniques further include assembling a subset of models from the plurality of machine learning models based on performance of the subset of models on the similar subset of the training data. The techniques further include generating an output from the subset of models for the dataset for evaluation.

Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.

Abstract: The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.