Patents by Inventor Junying Zhao

Junying Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120175502
    Abstract: Embodiments of the present invention provide an optical module, including an MT-Ferrule and a photoelectric conversion unit. The MT-Ferrule is configured to connect multiple channels of optical channels outside the optical module with multiple channels of optical channels of the photoelectric conversion unit, and implement coupling and transmission of multiple channels of single-mode optical signals between the two. The photoelectric conversion unit is configured to convert multiple channels of single-mode optical signals input from the MT-Ferrule into multiple channels of electrical signals and output the multiple channels of electrical signals, and generate, driven by multiple channels of input electrical signals, multiple channels of single-mode optical signals and output the multiple channels of single-mode optical signals to the MT-Ferrule.
    Type: Application
    Filed: March 20, 2012
    Publication date: July 12, 2012
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Fei Yu, Tongxin Zeng, Junying Zhao, Yuan Zhang
  • Publication number: 20100200277
    Abstract: A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block.
    Type: Application
    Filed: April 26, 2010
    Publication date: August 12, 2010
    Inventors: Mingli Huang, Shun Zhang, Xichen Yang, Junying Zhao, Bing Luo, Zhihai Li