Abstract: A strain sensor may have a conductive elastic yarn including a first fiber having a predetermined length and a shape of a fiber yarn and a second fiber having electrical conductivity and a sheet shape. The strain sensor may have a pair of wiring members electrically connected to both ends of the conductive elastic yarn. The conductive elastic yarn, with the second fiber wrapped around the first fiber, is twisted in a coil shape.

Abstract: A digital-analog converter of the disclosure converts digital image data to generate analog data signals. The digital-analog converter includes a voltage divider which generates a plurality of gamma reference voltages based on a first reference voltage and a second reference voltage; a global ramp including a plurality of gamma decoders which generates a plurality of global gamma voltages based on the gamma reference voltages; a decoder which selects one of the global gamma voltages according to the digital image data to generate the analog data signals; and a ramp controller which turns off at least some of the gamma decoders based on the digital image data.

Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.

Abstract: A display device includes a display panel including pixels connected to scan lines and data lines, and connection line connected to the scan lines, and a scan driver which drives scan lines. The scan driver includes a scan signal output circuit which outputs a first output signal as a scan signal to a first output line and outputs a second output signal to a second output line, a signal distribution circuit which outputs the first output signal to a first or third connection line and outputs the second output signal to a second or fourth connection line in response to first and second distribution control signals, and a scan-off circuit which outputs gate-off level to at least one of the scan lines in response to first and second scan-off control signals.

Abstract: A transceiver includes a transmitter and a receiver connected to each other through a first line and a second line. The transmitter transmits signals having a first voltage range to the first line and the second line in a first mode, and transmits signals having a second voltage range less than the first voltage range to the first line and the second line in a second mode. In transmitting a (1?1)-th payload to the receiver, the transmitter is sequentially driven in the first mode, the second mode, and the first mode, and transmits a first clock training pattern and the (1?1)-th payload in the second mode. The receiver includes a clock data recovery circuit generating a first clock signal corresponding to the received first clock training pattern and a register storing first frequency information and first phase information of the first clock training pattern.

Abstract: A transceiver device includes a transmitter and a receiver connected to each other through a first line and a second line. The transmitter transmits signals having a first voltage range to the first line and the second line in a first mode, and transmits signals having a second voltage range less than the first voltage range to the first line and the second line in a second mode. The transmitter encodes an original payload to generate a first payload in the second mode, and transmits a clock training pattern and the first payload through the first line and the second line. The receiver decodes the first payload and outputs reception data corresponding to the original payload in the second mode.

Abstract: A transceiver includes a transmitter and a receiver connected to each other by a first line and a second line. The transmitter transmits signals each having a first voltage range to the first line and the second line in a first mode, and signals each having a second voltage range less than the first voltage range to the first line and the second line in a second mode. The receiver includes a low-power driver which receives signals through the first line and the second line in an operating state of the first mode, and stops an operation thereof in the second mode, and a high-speed driver which receives signals through the first line and the second line in the second mode, and stops an operation thereof in the first mode.

Abstract: A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device compares a received signal with an original signal to generate a driving force control signal. The first semiconductor device also drives the original signal using a driving force in accordance with the driving force control signal to output an external transmission signal. The second semiconductor device receives the external transmission signal to generate a positive signal and a negative signal. The second semiconductor device also generates a restoration signal in response to the positive signal and the negative signal. The second semiconductor device additionally outputs the restoration signal as the external transmission signal to the first semiconductor device.

Abstract: A semiconductor device includes a chip body; a circuit layer over the chip body; an upper insulating layer over the circuit layer; a chip metal layer over the upper insulating layer, the chip metal layer including a pad portion; a passivation layer over the chip metal layer; a lower redistribution insulating layer over the passivation layer, the pad portion of the chip metal layer left exposed by the passivation layer and the lower redistribution insulating layer; a redistribution bonding interconnection over the lower redistribution insulating layer; and an upper redistribution insulating layer over the lower redistribution insulating layer.

Abstract: A transceiver includes a transmitter and a receiver connected to each other through a first line and a second line. The transmitter transmits signals having a first voltage range to the first line and the second line in a first mode, and transmits signals having a second voltage range less than the first voltage range to the first line and the second line in a second mode. In transmitting a (1-1)-th payload to the receiver, the transmitter is sequentially driven in the first mode, the second mode, and the first mode, and transmits a first clock training pattern and the (1-1)-th payload in the second mode. The receiver includes a clock data recovery circuit generating a first clock signal corresponding to the received first clock training pattern and a register storing first frequency information and first phase information of the first clock training pattern.

Abstract: A transceiver includes a transmitter and a receiver which are connected to each other through a first line and a second line. The transmitter transmits a first clock training pattern to the receiver in a first period, transmits a second clock training pattern and a first first payload to the receiver in a second period, and transmits a third clock training pattern and a second first payload to the receiver in a third period. The first clock training pattern, the second clock training pattern, and the third clock training pattern are variable based on a plurality of driving modes.

Abstract: A semiconductor package includes a package substrate, a connection pad including a recessed portion disposed on one surface of the package substrate, and an insulating pattern disposed on the one surface of the package substrate to be spaced apart from the connection pad. The connection pad includes an outer sidewall, an inner sidewall in the recessed portion inclining in an inward direction from an upper portion, and a groove pattern formed on the inner sidewall.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, input and output (I/O) pads disposed at an upper portion of the semiconductor substrate, and first bump pillars disposed over the I/O pads. The first bump pillars are selectively arranged over some of the I/O pads in a first horizontal direction.

Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.

Abstract: A digital-analog converter of the disclosure converts digital image data to generate analog data signals. The digital-analog converter includes a voltage divider which generates a plurality of gamma reference voltages based on a first reference voltage and a second reference voltage; a global ramp including a plurality of gamma decoders which generates a plurality of global gamma voltages based on the gamma reference voltages; a decoder which selects one of the global gamma voltages according to the digital image data to generate the analog data signals; and a ramp controller which turns off at least some of the gamma decoders based on the digital image data.

Abstract: A semiconductor package may be presented. The semiconductor package includes a first dielectric layer including a first surface and a second surface. First and second conductive lands are disposed on the first surface of the first dielectric layer. A first column formed by the first conductive lands and a second column formed by the second conductive lands are spaced apart from each other. Outer traces extend from the second conductive lands, and inner traces are disposed on the second surface of the first dielectric layer. Vias penetrate the first dielectric layer and respectively connect the first conductive lands to the inner traces. A semiconductor die is disposed on the first surface of the first dielectric layer.

Abstract: A semiconductor device includes a chip body; a passivation layer on the chip body; a lower dielectric layer on the passivation layer; a first re-distribution pad on the lower dielectric layer; an upper dielectric layer on the lower dielectric layer, the upper dielectric layer having a groove that exposes an upper surface of the first re-distribution pad; and a second re-distribution pad on the upper dielectric layer. An upper surface of the second re-distribution pad is positioned at a higher level than the upper surface of the first re-distribution pad.

Abstract: A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device compares a received signal with an original signal to generate a driving force control signal. The first semiconductor device also drives the original signal using a driving force in accordance with the driving force control signal to output an external transmission signal. The second semiconductor device receives the external transmission signal to generate a positive signal and a negative signal. The second semiconductor device also generates a restoration signal in response to the positive signal and the negative signal. The second semiconductor device additionally outputs the restoration signal as the external transmission signal to the first semiconductor device.

Abstract: A display panel includes an amorphous silicon gate driver in which a lower voltage than the gate-off voltage output from the gate driver is applied to an adjacent stage as a low voltage transmission signal.