Abstract: Disclosed are organic compounds including a structure of formula (I). The organic compound has a good rigid structure, so that the organic compound has good thermal stability, and high efficiency and the long lifetime of an OLED device are realized. Also provided are formulations containing the organic compounds, and at least one organic solvent. Further provided are organic electronic devices containing a functional layer, the functional layer comprises the organic compounds.

Abstract: Disclosed are formulations including an organic compound H, an emitter E, and an organic resin. Also provided are organic functional films containing the formulations. Further provided are organic light-emitting devices containing the formulations.

Abstract: The present disclosure disclose a video data decoding method. The method includes: receiving a bitstream; parsing the bitstream to obtain residual data of a current to-be-decoded image block, prediction information of the current to-be-decoded image block, and a pixel value transformation mode identifier of the current to-be-decoded block; obtaining predictors of the current to-be-decoded image block; obtaining reconstructed pixel values of pixels of the current to-be-decoded image block; and performing spatial transformation on the reconstructed pixel values of the pixels of the current to-be-decoded image block according to a pixel value transformation mode corresponding to the transformation mode identifier of the current to-be-decoded image block, to obtain transformed pixel values of the pixels of the current to-be-decoded image block. The embodiments of the present disclosure further disclose a video data encoding method, a decoding apparatus, and an encoding apparatus.

Abstract: The disclosure provides a quadrature hybrid. The quadrature hybrid has a first, second, third and fourth ports. The quadrature hybrid comprises: a substrate having a plurality of dielectric layers; a first, second and third capacitors, each capacitor having a first predetermined number of layers each being arranged on one of the plurality of dielectric layers; and a first, second, third and fourth inductors, each inductor having a second predetermined number of layers each being arranged on one of the plurality of dielectric layers.

Abstract: Capacitor structures having multiple layers of vertically interdigitated metal plates.

Abstract: A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

Abstract: The invention provides a bandpass filter, comprising: a substrate with a plurality of dielectric layers; a plurality of resonators; and a plurality of ground layers each having one slot arranged on; wherein the plurality of resonators are arrayed vertically each on respective one of the plurality of dielectric layers alternately without any of offsets, and each of the plurality of ground layers is between adjacent dielectric layers. Adjacent slots are arranged in opposite sides of the ground layers. The invention also provides a method of fabricating the bandpass filter.

Abstract: The invention provides a power divider, comprising: a plurality of transmission stages and a plurality of ground layers alternately arranged on respective ones of a plurality of dielectric layers, a first transmission stage being arranged on a first dielectric layer, and a last transmission stage being arranged below a last dielectric layer; wherein the plurality of transmission stages are arrayed vertically, each consisting of a loop formed by a transmission line; the first transmission stage has a first opening connected by a resistor, and each of the remaining transmission stages has the first opening connected by the resistor and a second opening without a resistor; two ends of the first opening of one of the adjacent transmission stages are connected to two ends of the second opening of the other one of the adjacent transmission stages by via transitions, in a top-to-bottom direction; and each ground layer has clearances through which the via transitions pass.

Abstract: The disclosure provides a quadrature hybrid. The quadrature hybrid has a first, second, third and fourth ports. The quadrature hybrid comprises: a substrate having a plurality of dielectric layers; a first, second and third capacitors, each capacitor having a first predetermined number of layers each being arranged on one of the plurality of dielectric layers; and a first, second, third and fourth inductors, each inductor having a second predetermined number of layers each being arranged on one of the plurality of dielectric layers.

Abstract: Embodiments of the present invention provide a capacitor structure. The capacitor structure comprises: a first plurality of metal plates that are vertically disposed with their surfaces being parallel to each other; a second plurality of metal plates that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates; a first port electrically connected to each of the first plurality of metal plates through a first plurality of port connecting strips and via a first port via interconnection; and a second port electrically connected to each of the second plurality of metal plates through a second plurality of port connecting strips and via a second port via interconnection. The first plurality of metal plates is connected together at an end of each of the first plurality of metal plates opposite to the end at which the first port is connected.

Abstract: A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

Abstract: The present disclosure provides a via transition, comprising: two end segments; high-impedance segments and low-impedance segments. The high-impedance segments and the low-impedance segments are alternately arranged between the two end segments, and the via transition is formed in a substrate. The disclosure also provides a power divider comprising the via transition and a method of fabricating the low-pass via transition.

Abstract: The invention provides a power divider, comprising: a plurality of transmission stages and a plurality of ground layers alternately arranged on respective ones of a plurality of dielectric layers, a first transmission stage being arranged on a first dielectric layer, and a last transmission stage being arranged below a last dielectric layer; wherein the plurality of transmission stages are arrayed vertically, each consisting of a loop formed by a transmission line; the first transmission stage has a first opening connected by a resistor, and each of the remaining transmission stages has the first opening connected by the resistor and a second opening without a resistor; two ends of the first opening of one of the adjacent transmission stages are connected to two ends of the second opening of the other one of the adjacent transmission stages by via transitions, in a top-to-bottom direction; and each ground layer has clearances through which the via transitions pass.

Abstract: The invention provides a bandpass filter, comprising: a substrate with a plurality of dielectric layers; a plurality of resonators; and a plurality of ground layers each having one slot arranged on; wherein the plurality of resonators are arrayed vertically each on respective one of the plurality of dielectric layers alternately without any of offsets, and each of the plurality of ground layers is between adjacent dielectric layers. Adjacent slots are arranged in opposite sides of the ground layers. The invention also provides a method of fabricating the bandpass filter.