Abstract: A semiconductor package includes a substrate including a first region, a second region in contact with the first region with the first and second regions stacked in a first direction, and a third region extending from the first and second regions in a second direction, perpendicular to the first direction, to connect the first and second regions to each other in bent form, a first semiconductor chip on a first side opposite to a second side of the first region in contact with the second region, a second semiconductor chip on a first side opposite to a second side of the second region in contact with the first region, a first molding member on the first region and covering at least a portion of the first semiconductor chip, and a second molding member on the second region and covering at least a portion of the second semiconductor chip.

Abstract: Disclosed herein is a vehicle that includes a sound receiver to receive a sound signal, a controller, and a memory storing a program to be executed in the controller. The program includes instructions to estimate an alarm sound model of the sound signal by determining an alarm sound model matching the sound signal among at least one alarm sound model stored beforehand.