Abstract: The present invention discloses an iterative learning control (ILC) method for a multi-particle vehicle platoon driving system, and relates to the field of ILC. The method includes: firstly, discretizing a multi-particle train dynamic equation using a finite difference method to obtain a partial recurrence equation, and then transforming the partial recurrence equation into a spatially interconnected system model; secondly, transforming the spatially interconnected system model into an equivalent one-dimensional dynamic model using a lifting technology, and in order to compensate input delay, designing an ILC law based on a state observer; and thirdly, transforming a controlled object into an equivalent discrete repetitive process according to the ILC law, and converting a controller combination problem into a linear matrix inequality based on stability analysis of the repetitive process.

Abstract: In implementations of the present disclosure, there is provided a method for access point (AP) validation. The method comprises detecting a trigger event for validating a network including a plurality of APs, and selecting a target AP from the plurality of APs based on a neighbor table of an AP associated with the detected trigger event. The method further comprises determining a validation case corresponding to the detected trigger event from a knowledge base. The method further comprises sending the validation case to the target AP, and, receiving a result of performance of the validation case from the target AP in response to the validation case being performed. Implementations of the present disclosure can validate whether the network change takes effect in the network automatically, and can improve the validation efficiency of the network changes.

Abstract: A method for forming an ultrafine-pitch all-copper interconnect structure is provided. Nano-copper particles are mixed with a solvent, a dispersant and a viscosity modifier to prepare a nano-copper paste. A chip with a preset number of copper pillars having a preset diameter and a substrate are selected, cleaned and pretreated. The chip is sucked and flipped by a bonding machine to make the copper pillars face outward. The chip is sucked through a suction nozzle of the bonding machine and dipped in the nano-copper paste. A protective gas is fed, and the copper pillars are aligned with copper pads on the substrate through an optical system of the bonding machine, bonded with the substrate at a preset pressure and temperature under ultrasonication, and cooled at room temperature to obtain the interconnect structure. An ultrafine-pitch all-copper interconnect structure fabricated by the method is also provided.