Abstract: A bonding apparatus and a bonding method for a chip. The apparatus includes: a movable pick-up stage, configured to move a first element; a carrier stage, configured to move a second element; a correction component, providing a correction mark; and an image-acquisition device. The image-acquisition device is configured to read an alignment mark of the first element and the correction mark, and determine a first relative positional relationship between the first element and the correction component; and further configured to read an alignment mark of the second element and the correction mark, and determine a second relative positional relationship between the second element and the correction component. The bonding apparatus is configured to determine an alignment offset between the first element and the second element; and perform an alignment compensation operation, enabling the first element and the second element to be aligned and bonded.

Abstract: A bonding apparatus includes: a movable pick-up stage carrying a first element; a carrier stage carrying a second element; and an image acquisition device for reading an alignment mark of the first element and an alignment mark of the second element. The alignment mark of the first element and the alignment mark of the second element are in one coordinate system. The bonding apparatus determines an alignment offset between the first element and the second element based on coordinate information of the alignment mark of the first element, coordinate information of the alignment mark of the second element, and preset calibration information of the image acquisition device. The bonding apparatus adjusts the movable pick-up stage and/or the carrier stage to perform an alignment compensation operation based on the alignment offset, enabling the first element and the second element to be aligned and bonded to each other.

Abstract: A bonding apparatus having a system-error compensation function is provided. The device includes: a movable object pick-up stage, configured to move a first element; a carrier stage, configured to move a second element; a first image-acquisition device, configured to read alignment marks of the first element and the second element driven to an alignment position; and a second image-acquisition device, configured to, in response to the bonding apparatus performing a system-error correction operation, read alignment marks of the first element and the second element driven to a bonding position, for obtaining a system-error compensation value. In response to the bonding apparatus performing a bonding operation, the bonding apparatus performs a system-error compensation operation based on the system-error compensation value, so that the first element and the second element driven to the bonding position are aligned.

Abstract: A bonding apparatus and a bonding method are provided. The bonding apparatus includes: a machine base, including a movable pick-up platform; and a laser interferometer assembly. The laser interferometer assembly includes: a first laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a first direction; and a second laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a second direction. Based on the displacement information along the first direction and the displacement information along the second direction, the laser interferometer assembly is further configured to determine coordinate information of the movable pick-up platform.

Abstract: A bonding apparatus and a bonding method are provided. The bonding apparatus includes: a machine base, including a movable pick-up platform; and a grating assembly, configured to determine displacement information of the movable pick-up platform along a first direction and displacement information of the movable pick-up platform along a second direction. Based on the displacement information along the first direction and the displacement information along the second direction, the grating assembly is further configured to determine coordinate information of the movable pick-up platform.