Abstract: A semiconductor pressure sensor has an encased sensor unit, and a metal casing having a pressure introduction pipe and housing therein the sensor unit. The metal casing has therein synthetic resin poured by potting to fix the sensor unit securely in the metal casing. Through-type capacitors are affixed to the metal casing. The sensor unit produces an electrical signal transmitted out through the through-type capacitors and over lead wires connected to the through-type capacitors. With this arrangement, the semiconductor pressure sensor is protected against electromagnetic interference (EMI), and moisture is prevented from entering the metal casing.