Abstract: A wafer inspection method improving inspection accuracy and operation efficiency. A method for performing electrical inspection by bringing into contact with pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads recognizing the positional shifts of the pads due to thermal expansion; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.

Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other.

Abstract: A wafer inspection method whereby inspection accuracy and operation efficiency is improved. A method for performing electrical inspection by bringing, at one time, a plurality of probes into contact with a plurality of pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads of the chips; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads for the purpose of recognizing the positional shifts of the pads due to thermal expansion when the wafer chuck is heated; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.

Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other.