Patents by Inventor Junzo Matsuda

Junzo Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9189033
    Abstract: Presented is a touchscreen panel sensor film with alignment marks or product information assigned thereto, this sensor film being formed so as to improve in post-processing accuracy. The touchscreen panel sensor film according to this invention includes a transparent base film and a transparent electrical conductor pattern provided on at least one surface of the base film, and achieves the improvement of post-processing accuracy by having alignment marks or product information in a non-active area on the sensor film.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: November 17, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Masahiro Takahashi, Mitsuru Iida, Yutaka Matsumoto, Junzo Matsuda, Kazuya Ogawa, Tatsuhiko Ishigami
  • Publication number: 20140036165
    Abstract: Disclosed is a touchscreen panel sensor film with alignment marks or product information assigned thereto, this sensor film being formed so as to improve in post-processing accuracy. The touchscreen panel sensor film according to this invention includes a transparent base film and a transparent electrical conductor pattern provided on at least one surface of the base film, and achieves the improvement of post-processing accuracy by having alignment marks or product information in a non-active area on the sensor film.
    Type: Application
    Filed: July 10, 2013
    Publication date: February 6, 2014
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Masahiro TAKAHASHI, Mitsuru IIDA, Yutaka MATSUMOTO, Junzo MATSUDA, Kazuya OGAWA, Tatsuhiko ISHIGAMI
  • Patent number: 4027295
    Abstract: A magnetic bubble device has a flat faced drive coil consisting of electrically conductive material having flat windings. The magnetic bubble chip of the device is positioned in the magnetic field produced by the flat faced coil.
    Type: Grant
    Filed: November 29, 1974
    Date of Patent: May 31, 1977
    Assignee: Fujitsu Ltd.
    Inventors: Harumi Maegawa, Junzo Matsuda