Patents by Inventor Junzo Shimbe

Junzo Shimbe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959516
    Abstract: This hollow shaft member 10 includes paired diameter-reduced sections 11 respectively formed at both shaft ends of a hollow shaft-like tubular material by performing swaging processing on both the shaft ends, and an intermediate section 12 located between the paired diameter-reduced sections, and having an outer diameter larger than an outer diameter of the paired diameter-reduced sections. Shapes of connection boundaries between the intermediate section 12 and the diameter-reduced sections 11 are formed as perpendicular step-shaped sections 13 stepped substantially perpendicular to an axial direction, and the perpendicular step-shaped sections 13 are formed by the swaging processing.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: April 16, 2024
    Assignee: THK CO., LTD.
    Inventors: Toru Takahashi, Junzo Shimbe, Hidetada Suzuki
  • Publication number: 20220178401
    Abstract: This hollow shaft member 10 includes paired diameter-reduced sections 11 respectively formed at both shaft ends of a hollow shaft-like tubular material by performing swaging processing on both the shaft ends, and an intermediate section 12 located between the paired diameter-reduced sections, and having an outer diameter larger than an outer diameter of the paired diameter-reduced sections. Shapes of connection boundaries between the intermediate section 12 and the diameter-reduced sections 11 are formed as perpendicular step-shaped sections 13 stepped substantially perpendicular to an axial direction, and the perpendicular step-shaped sections 13 are formed by the swaging processing. With such a configuration, a hollow shaft member for a rolling device in which a weight reduction has been achieved can be provided.
    Type: Application
    Filed: March 10, 2020
    Publication date: June 9, 2022
    Applicant: THK CO., LTD.
    Inventors: Toru Takahashi, Junzo Shimbe, Hidetada Suzuki
  • Patent number: 10422014
    Abstract: A heat-treatment device 10 includes a table 11 on which a ring-shaped workpiece W can be placed, and a pair of heat processing units 20 for heat-processing the peripheral surface of the workpiece W. The heat-treatment device 10 is used for obtaining the workpiece W having desired properties by the heat-processing the workpiece W while the pair of heat processing units 20 move in opposite directions along the peripheral surface of the workpiece W. The heat-treatment device 10 is configured in such a way that a pair of revolving arms 30 movable relative to the table 11 oscillate the pair of heat processing units 20 relative to the workpiece W, thereby heat-processing the peripheral surface of the workpiece W. By adopting such a configuration, it is possible to obtain a heat-treatment device heat-processing the entire circumference of a ring-shaped workpiece.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: September 24, 2019
    Assignees: THK CO., LTD., Denki Kogyo Company, Limited
    Inventors: Junzo Shimbe, Hiroshi Nakabayashi, Takayuki Sakanoue, Kazuki Yoshiya, Hiroyuki Kai, Shuji Masubuchi, Makoto Nagata
  • Publication number: 20160369366
    Abstract: A heat-treatment device 10 includes a table 11 on which a ring-shaped workpiece W can be placed, and a pair of heat processing units 20 for heat-processing the peripheral surface of the workpiece W. The heat-treatment device 10 is used for obtaining the workpiece W having desired properties by the heat-processing the workpiece W while the pair of heat processing units 20 move in opposite directions along the peripheral surface of the workpiece W. The heat-treatment device 10 is configured in such a way that a pair of revolving arms 30 movable relative to the table 11 oscillate the pair of heat processing units 20 relative to the workpiece W, thereby heat-processing the peripheral surface of the workpiece W. By adopting such a configuration, it is possible to obtain a heat-treatment device heat-processing the entire circumference of a ring-shaped workpiece.
    Type: Application
    Filed: March 11, 2015
    Publication date: December 22, 2016
    Applicants: THK CO., LTD., Denki Kogyo Company, Limited
    Inventors: Junzo Shimbe, Hiroshi Nakabayashi, Takayuki Sakanoue, Kazuki Yoshiya, Hiroyuki Kai, Shuji Masubuchi, Makoto Nagata