Patents by Inventor Jurg Schwizer

Jurg Schwizer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6929168
    Abstract: A method for finding optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a shear force exerted by the capillary on a connection point. A predetermined number of bonding operations with varying bonding parameters is performed. Optimum bond parameters are derived from the signal of the sensor.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: August 16, 2005
    Assignee: ESEC Trading SA
    Inventors: Michael Mayer, Jürg Schwizer
  • Patent number: 6648205
    Abstract: A Wire Bonder has a capillary clamped to a horn. An ultrasonic transducer applies ultrasonics to the horn whereby the ultrasonic transducer is controlled by a parameter P. For calibration of the parameter P, a pizoresistive sensor integrated into a semiconductor chip is used. The capillary is lowered onto the semiconductor chip and a bond force is applied to it. Afterwards, a value P1 of the parameter P is applied to the ultrasonic transducer and the output signal of the sensor is stored as the reference value URef as soon as the transient reaction is concluded. The bond force is selected great enough so that the capillary does not slide back and forth. The Wire Bonder, for example after changing the capillary, is then recalibrated in that a correction factor &ggr; is analogously determined so that the amplitude of the sensor signal assumes the value URef when the ultrasonic transducer is operated with the value P2=&ggr;*P1.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: November 18, 2003
    Assignee: ESEC Trading SA
    Inventors: Michael Mayer, Jürg Schwizer
  • Publication number: 20030146265
    Abstract: Optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a Wire Bonder can be determined by means of a method with the following steps:
    Type: Application
    Filed: February 3, 2003
    Publication date: August 7, 2003
    Applicant: ESEC Trading SA
    Inventors: Michael Mayer, Jurg Schwizer
  • Publication number: 20030080176
    Abstract: A Wire Bonder has a capillary clamped to a horn. An ultrasonic transducer applies ultrasonics to the horn whereby the ultrasonic transducer is controlled by a parameter P. For calibration of the parameter P, a pizoresistive sensor integrated into a semiconductor chip is used. The capillary is lowered onto the semiconductor chip and a bond force is applied to it. Afterwards, a value P1 of the parameter P is applied to the ultrasonic transducer and the output signal of the sensor is stored as the reference value URef as soon as the transient reaction is concluded. The bond force is selected great enough so that the capillary does not slide back and forth.
    Type: Application
    Filed: May 30, 2002
    Publication date: May 1, 2003
    Inventors: Michael Mayer, Jurg Schwizer