Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A structural unit includes a cylindrical component and a metal-plate element having a through-neck, and the cylindrical component extends though the through-neck and is attached to the cylindrical component. The through-neck substantially determines a position of the metal-plate element relative to the cylindrical component with respect to a radial direction of the cylindrical component. Also an oil mist separator including the structural unit.

Abstract: A bearing carrier or a housing part includes a base body, a first component and at least one second component mounted in the base body, and a belt or a cable or a roving connected to the base body and to the first component and the second component such that the belt or the cable or the roving at least partially transmits forces that act on the first component to the second component. The first and second components may each be formed as rings having a cylindrical inner surface and an outer surface having a groove, and the element may pass through the grooves of the first and second components and be embedded in the base body.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A structural unit includes a cylindrical component and a metal-plate element having a through-neck, and the cylindrical component extends though the through-neck and is attached to the cylindrical component. The through-neck substantially determines a position of the metal-plate element relative to the cylindrical component with respect to a radial direction of the cylindrical component. Also an oil mist separator including the structural unit.

Abstract: A bearing carrier or a housing part includes a base body, a first component and at least one second component mounted in the base body, and a belt or a cable or a roving connected to the base body and to the first component and the second component such that the belt or the cable or the roving at least partially transmits forces that act on the first component to the second component. The first and second components may each be formed as rings having a cylindrical inner surface and an outer surface having a groove, and the element may pass through the grooves of the first and second components and be embedded in the base body.

Abstract: A bearing assembly includes a roller bearing connected with a plate-shaped bearing support. The bearing support has a receiving bore for an outer ring of the roller bearing, and the outer ring of the roller bearing is affixed to the bearing support with two affixing plates that are fixed to first and second end sides of the bearing support. The two affixing plates clamp the outer ring at two clamping surfaces. An axial spacing of the first and second end sides of the bearing support is smaller than an axial spacing of the clamping surfaces of the outer ring, and a spring element configured to act in the axial direction is disposed between one of the two affixing plates and the bearing support.

Abstract: A bearing assembly includes a roller bearing connected with a bearing support having a plate-shaped section. The bearing support has a receiving bore for an outer ring of the roller bearing, and the outer ring of the roller bearing is affixed to the bearing support with two affixing plates that are fixed to first and second end sides of the bearing support and that clamp the outer ring at two clamping surfaces. An axial spacing of the first and second end sides of the bearing support is smaller than an axial spacing of the clamping surfaces of the outer ring, and the two affixing plates have a different mechanical strength.

Abstract: A bearing arrangement is disclosed having a bearing and a bearing support. The bearing is coupled to the bearing support at an axial side. The bearing provides first and second bearing rings that define a bearing interior there between. A first groove is formed at the first bearing ring's radial side facing the second bearing ring. A coupling element is arranged at the bearing's axial side facing the bearing support. The coupling element includes a first, preferably nose-shaped, radial protrusion that is in engagement with the first groove, and a second radial protrusion, which at least partially encompasses the bearing support at a side facing away from the bearing, so that the coupling element fastens the bearing to the bearing support. A coupling element for such a bearing arrangement is also provided.

Abstract: A bearing arrangement is disclosed having a bearing and a bearing support. The bearing is coupled to the bearing support at an axial side. The bearing provides first and second bearing rings that define a bearing interior there between. A first groove is formed at the first bearing ring's radial side facing the second bearing ring. A coupling element is arranged at the bearing's axial side facing the bearing support. The coupling element includes a first, preferably nose-shaped, radial protrusion that is in engagement with the first groove, and a second radial protrusion, which at least partially encompasses the bearing support at a side facing away from the bearing, so that the coupling element fastens the bearing to the bearing support. A coupling element for such a bearing arrangement is also provided.

Abstract: A bearing assembly includes a roller bearing connected with a bearing support having a plate-shaped section. The bearing support has a receiving bore for an outer ring of the roller bearing, and the outer ring of the roller bearing is affixed to the bearing support with two affixing plates that are fixed to first and second end sides of the bearing support and that clamp the outer ring at two clamping surfaces. An axial spacing of the first and second end sides of the bearing support is smaller than an axial spacing of the clamping surfaces of the outer ring, and the two affixing plates have a different mechanical strength.

Abstract: A bearing assembly includes a roller bearing connected with a plate-shaped bearing support. The bearing support has a receiving bore for an outer ring of the roller bearing, and the outer ring of the roller bearing is affixed to the bearing support with two affixing plates that are fixed to first and second end sides of the bearing support. The two affixing plates clamp the outer ring at two clamping surfaces. An axial spacing of the first and second end sides of the bearing support is smaller than an axial spacing of the clamping surfaces of the outer ring, and a spring element configured to act in the axial direction is disposed between one of the two affixing plates and the bearing support.

Abstract: The invention concerns processes and solutions for the treatment of copper alloy surfaces, which are subsequently to be firmly bonded to polymeric material. The solution is used, in particular for firmly bonding lead frames to encapsulating molding compounds (polymeric material). The solution contains an oxidant, at least one acid, at least one adhesion-enhancing compound characterized in that the solution additionally contains fluoride ions in an amount of at least 100 mg per litre and chloride ions in an amount of 5 to 40 mg per litre. The solution is particularly useful for treatment of copper alloy surfaces, containing alloying elements selected from the group consisting of Si, Ni, Fe, Zr, P, Sn and Zn.

Abstract: The invention concerns processes and solutions for the treatment of copper alloy surfaces, which are subsequently to be firmly bonded to polymeric material. The solution is used, in particular for firmly bonding lead frames to encapsulating molding compounds (polymeric material). The solution contains an oxidant, at least one acid, at least one adhesion-enhancing compound characterized in that the solution additionally contains fluoride ions in an amount of at least 100 mg per litre and chloride ions in an amount of 5 to 40 mg per litre. The solution is particularly useful for treatment of copper alloy surfaces, containing alloying elements selected from the group consisting of Si, Ni, Fe, Zr, P, Sn and Zn.

Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Abstract: The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode.

Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.