Patents by Inventor Jurgen Fleischer

Jurgen Fleischer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12097612
    Abstract: Modular gripping finger for arrangement on a movable gripper jaw of a gripping device, having at least two rigidly interconnected finger modules, the finger modules including one or more base modules for forming a geometric shape of the gripping finger and including an end module having a gripping surface, the end module including an electrical end module interface and at least one sensor which is or can be connected to the end module interface.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: September 24, 2024
    Assignee: SCHUNK GmbH & Co. KG Spann -und Greiftechnik
    Inventors: Christian Friedrich, Jürgen Fleischer, Marco Friedmann
  • Publication number: 20230198356
    Abstract: The invention relates to a method and device (10) for forming winding elements, in particular hairpin winding elements, from a conductor piece (12).
    Type: Application
    Filed: September 11, 2020
    Publication date: June 22, 2023
    Applicant: Gehring Technologies GmbH + Co. KG
    Inventors: Felix Wirth, Jürgen Fleischer, Pier Vai, Fabrizio Giuradei, Federica Forte
  • Publication number: 20230105264
    Abstract: The invention relates to a device and a method for transferring conductor parts, in particular plug-in winding elements bent into a U-shape, also known as hairpins, into a desired arrangement.
    Type: Application
    Filed: February 25, 2021
    Publication date: April 6, 2023
    Applicant: Gehring Technologies GmbH + Co. KG
    Inventors: Ludwig Hausmann, Jürgen Fleischer, Andreas Wiens
  • Publication number: 20230030444
    Abstract: Modular gripping finger for arrangement on a movable gripper jaw of a gripping device, having at least two rigidly interconnected finger modules, the finger modules including one or more base modules for forming a geometric shape of the gripping finger and including an end module having a gripping surface, the end module including an electrical end module interface and at least one sensor which is or can be connected to the end module interface.
    Type: Application
    Filed: April 20, 2021
    Publication date: February 2, 2023
    Applicant: SCHUNK GmbH & Co. KG Spann- und Greiftechnik
    Inventors: Christian Friedrich, Jürgen Fleischer, Marco Friedmann
  • Patent number: 9630378
    Abstract: A device (1) for automated connection of two components (25, 27) in joint region (29) is proposed. The device (1) has a rotating winding device, especially a circle-segment-like rotor (3), which is arranged to guide a cloth tape (23) along winding paths (26) and to create a wound joint connection in the joint region (29).
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: April 25, 2017
    Assignee: KARLSRUHER INSTITUT F ÜR TECHNOLOGIE
    Inventors: Jürgen Fleischer, Jochen Schädel
  • Patent number: 9632108
    Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: April 25, 2017
    Assignee: HSBC Bank USA, National Association
    Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
  • Publication number: 20160285133
    Abstract: The invention relates to an electrode assembly (110), which comprises a layer structure with at least one first electrode (112), at least one second electrode (130) and at least one separator (116) inserted between the first electrode (112) and the second electrode (130). The first electrode (112) has here at least one first conductive band (114), the first conductive band (114) being folded in a first zigzag fold, the first zigzag fold having the effect of forming a plurality of first layers (120, 122) lying one over the other and first folding edges (134, 136) that lie opposite one another of the first zigzag fold defining a first folding direction (138) of the first zigzag fold.
    Type: Application
    Filed: November 12, 2014
    Publication date: September 29, 2016
    Inventors: Manuel BAUMEISTER, Sebastian HAAG, Jurgen FLEISCHER
  • Publication number: 20140239991
    Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
    Type: Application
    Filed: April 2, 2014
    Publication date: August 28, 2014
    Applicant: CASCADE MICROTECH, INC.
    Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
  • Patent number: 8692567
    Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: April 8, 2014
    Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
  • Publication number: 20140093309
    Abstract: A device (1) for automated connection of two components (25, 27) in joint region (29) is proposed. The device (1) has a rotating winding device, especially a circle-segment-like rotor (3), which is arranged to guide a cloth tape (23) along winding paths (26) and to create a wound joint connection in the joint region (29).
    Type: Application
    Filed: September 27, 2013
    Publication date: April 3, 2014
    Applicant: Karlsruher Institut fur Technologie
    Inventors: Jürgen FLEISCHER, Jochen SCHÄDEL
  • Patent number: 8278951
    Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: October 2, 2012
    Assignee: Cascade Microtech, Inc.
    Inventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
  • Publication number: 20110241711
    Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
    Type: Application
    Filed: July 31, 2009
    Publication date: October 6, 2011
    Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
  • Patent number: 7733108
    Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: June 8, 2010
    Assignee: SUSS Microtec Test Systems GmbH
    Inventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kressig, Jorg Kiesewetter
  • Patent number: 7652491
    Abstract: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes comprises a probe card holder, a probe card, and a probe card adapter, The probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed such that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from the holder. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: January 26, 2010
    Assignee: SUSS MicroTec Test Systems GmbH
    Inventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
  • Patent number: 7560942
    Abstract: To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: July 14, 2009
    Assignee: SUSS MicroTec Test Systems GmbH
    Inventors: Hans-Jurgen Fleischer, Axel Schmidt, Stojan Kanev, Axel Becker
  • Publication number: 20090085595
    Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
    Type: Application
    Filed: December 8, 2008
    Publication date: April 2, 2009
    Applicant: SUSS MICROTEC TEST SYSTEMS GMBH
    Inventors: Stojan KANEV, Hans-Jurgen FLEISCHER, Stefan KREISSIG, Jorg KIESEWETTER
  • Publication number: 20090021275
    Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
    Type: Application
    Filed: November 29, 2007
    Publication date: January 22, 2009
    Applicant: SUSS MicroTec Test Systems GmbH
    Inventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Jorg Kiesewetter
  • Publication number: 20080116911
    Abstract: To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.
    Type: Application
    Filed: February 13, 2007
    Publication date: May 22, 2008
    Applicant: SUSS MICROTEC TEST SYSTEMS GMBH
    Inventors: Hans-Jurgen FLEISCHER, Axel SCHMIDT, Stojan KANEV, Axel BECKER
  • Publication number: 20080116917
    Abstract: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes is specified. A process for testing test substrates in such a prober is also specified. The probe support comprises a probe card holder, a probe card, and a probe card adapter, where the probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed in such a manner that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from it.
    Type: Application
    Filed: November 15, 2007
    Publication date: May 22, 2008
    Applicant: SUSS MicroTec Test Systems GmbH
    Inventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
  • Patent number: 7057408
    Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: June 6, 2006
    Assignee: SUSS MicroTec Test Systems (GmbH)
    Inventors: Stefan Schneidewind, Claus Dietrich, Jörg Kiesewetter, Stojan Kanev, Stefan Kreissig, Frank Fehrmann, Hans-Jürgen Fleischer