Patents by Inventor Jurgen Fleischer
Jurgen Fleischer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12097612Abstract: Modular gripping finger for arrangement on a movable gripper jaw of a gripping device, having at least two rigidly interconnected finger modules, the finger modules including one or more base modules for forming a geometric shape of the gripping finger and including an end module having a gripping surface, the end module including an electrical end module interface and at least one sensor which is or can be connected to the end module interface.Type: GrantFiled: April 20, 2021Date of Patent: September 24, 2024Assignee: SCHUNK GmbH & Co. KG Spann -und GreiftechnikInventors: Christian Friedrich, Jürgen Fleischer, Marco Friedmann
-
Publication number: 20230198356Abstract: The invention relates to a method and device (10) for forming winding elements, in particular hairpin winding elements, from a conductor piece (12).Type: ApplicationFiled: September 11, 2020Publication date: June 22, 2023Applicant: Gehring Technologies GmbH + Co. KGInventors: Felix Wirth, Jürgen Fleischer, Pier Vai, Fabrizio Giuradei, Federica Forte
-
Publication number: 20230105264Abstract: The invention relates to a device and a method for transferring conductor parts, in particular plug-in winding elements bent into a U-shape, also known as hairpins, into a desired arrangement.Type: ApplicationFiled: February 25, 2021Publication date: April 6, 2023Applicant: Gehring Technologies GmbH + Co. KGInventors: Ludwig Hausmann, Jürgen Fleischer, Andreas Wiens
-
Publication number: 20230030444Abstract: Modular gripping finger for arrangement on a movable gripper jaw of a gripping device, having at least two rigidly interconnected finger modules, the finger modules including one or more base modules for forming a geometric shape of the gripping finger and including an end module having a gripping surface, the end module including an electrical end module interface and at least one sensor which is or can be connected to the end module interface.Type: ApplicationFiled: April 20, 2021Publication date: February 2, 2023Applicant: SCHUNK GmbH & Co. KG Spann- und GreiftechnikInventors: Christian Friedrich, Jürgen Fleischer, Marco Friedmann
-
Patent number: 9630378Abstract: A device (1) for automated connection of two components (25, 27) in joint region (29) is proposed. The device (1) has a rotating winding device, especially a circle-segment-like rotor (3), which is arranged to guide a cloth tape (23) along winding paths (26) and to create a wound joint connection in the joint region (29).Type: GrantFiled: September 27, 2013Date of Patent: April 25, 2017Assignee: KARLSRUHER INSTITUT F ÜR TECHNOLOGIEInventors: Jürgen Fleischer, Jochen Schädel
-
Patent number: 9632108Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.Type: GrantFiled: April 2, 2014Date of Patent: April 25, 2017Assignee: HSBC Bank USA, National AssociationInventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
-
Publication number: 20160285133Abstract: The invention relates to an electrode assembly (110), which comprises a layer structure with at least one first electrode (112), at least one second electrode (130) and at least one separator (116) inserted between the first electrode (112) and the second electrode (130). The first electrode (112) has here at least one first conductive band (114), the first conductive band (114) being folded in a first zigzag fold, the first zigzag fold having the effect of forming a plurality of first layers (120, 122) lying one over the other and first folding edges (134, 136) that lie opposite one another of the first zigzag fold defining a first folding direction (138) of the first zigzag fold.Type: ApplicationFiled: November 12, 2014Publication date: September 29, 2016Inventors: Manuel BAUMEISTER, Sebastian HAAG, Jurgen FLEISCHER
-
Publication number: 20140239991Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.Type: ApplicationFiled: April 2, 2014Publication date: August 28, 2014Applicant: CASCADE MICROTECH, INC.Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
-
Patent number: 8692567Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.Type: GrantFiled: July 31, 2009Date of Patent: April 8, 2014Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
-
Publication number: 20140093309Abstract: A device (1) for automated connection of two components (25, 27) in joint region (29) is proposed. The device (1) has a rotating winding device, especially a circle-segment-like rotor (3), which is arranged to guide a cloth tape (23) along winding paths (26) and to create a wound joint connection in the joint region (29).Type: ApplicationFiled: September 27, 2013Publication date: April 3, 2014Applicant: Karlsruher Institut fur TechnologieInventors: Jürgen FLEISCHER, Jochen SCHÄDEL
-
Patent number: 8278951Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.Type: GrantFiled: November 15, 2007Date of Patent: October 2, 2012Assignee: Cascade Microtech, Inc.Inventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
-
Publication number: 20110241711Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.Type: ApplicationFiled: July 31, 2009Publication date: October 6, 2011Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
-
Patent number: 7733108Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.Type: GrantFiled: December 8, 2008Date of Patent: June 8, 2010Assignee: SUSS Microtec Test Systems GmbHInventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kressig, Jorg Kiesewetter
-
Patent number: 7652491Abstract: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes comprises a probe card holder, a probe card, and a probe card adapter, The probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed such that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from the holder. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component.Type: GrantFiled: November 15, 2007Date of Patent: January 26, 2010Assignee: SUSS MicroTec Test Systems GmbHInventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
-
Patent number: 7560942Abstract: To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.Type: GrantFiled: February 13, 2007Date of Patent: July 14, 2009Assignee: SUSS MicroTec Test Systems GmbHInventors: Hans-Jurgen Fleischer, Axel Schmidt, Stojan Kanev, Axel Becker
-
Publication number: 20090085595Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.Type: ApplicationFiled: December 8, 2008Publication date: April 2, 2009Applicant: SUSS MICROTEC TEST SYSTEMS GMBHInventors: Stojan KANEV, Hans-Jurgen FLEISCHER, Stefan KREISSIG, Jorg KIESEWETTER
-
Publication number: 20090021275Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.Type: ApplicationFiled: November 29, 2007Publication date: January 22, 2009Applicant: SUSS MicroTec Test Systems GmbHInventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Jorg Kiesewetter
-
Publication number: 20080116911Abstract: To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.Type: ApplicationFiled: February 13, 2007Publication date: May 22, 2008Applicant: SUSS MICROTEC TEST SYSTEMS GMBHInventors: Hans-Jurgen FLEISCHER, Axel SCHMIDT, Stojan KANEV, Axel BECKER
-
Publication number: 20080116917Abstract: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes is specified. A process for testing test substrates in such a prober is also specified. The probe support comprises a probe card holder, a probe card, and a probe card adapter, where the probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed in such a manner that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from it.Type: ApplicationFiled: November 15, 2007Publication date: May 22, 2008Applicant: SUSS MicroTec Test Systems GmbHInventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
-
Patent number: 7057408Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.Type: GrantFiled: June 29, 2004Date of Patent: June 6, 2006Assignee: SUSS MicroTec Test Systems (GmbH)Inventors: Stefan Schneidewind, Claus Dietrich, Jörg Kiesewetter, Stojan Kanev, Stefan Kreissig, Frank Fehrmann, Hans-Jürgen Fleischer