Abstract: The invention provides method for preparing a conductive device comprising the steps of: (a) providing a non-conductive substrate layer; (b) modifying the surface of the non-conductive substrate layer by means of a laser beam treatment; (c) applying a pattern of an ink on a surface of the substrate layer, which ink comprises a first metal; (d) depositing a second metal on the ink pattern obtained in step (c); and (e) applying a third metal on the second metal by means of electrodeposition. The invention further provides a conductive device obtainable by said method.

Abstract: In a method of making plastic articles with embossed pattern, a plastic material is injection-molded in a cavity of a clamping unit of an injection molding machine to form an injection-molded plastic article. A pattern is embossed from a foil strip onto a previously injection-molded plastic article to form a finished plastic product with embossed pattern, whereby the embossing step is decoupled from the injection molding step and carried out separately from a clamping step of the clamping unit.