Abstract: A vacuum orientation module for a substrate processing system is described. The module includes at least a first vacuum orientation chamber, comprising: a vacuum chamber; a first transportation track within the vacuum chamber, the first transportation track having a first support structure and a first driving structure and defining a transportation direction; an orientation actuator to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has a first pair of two slit openings, particularly essentially vertical slit openings, at opposing side walls of the vacuum chamber in the transportation direction; and a second transportation track within the vacuum chamber, the second transportation track having a second support structure and a second driving structure extending along the transportation direction, the vacuum chamber has a second pair of two slit openings at the opposing side walls of the vacuum chamber.

Abstract: A vacuum orientation module for a substrate processing system is described. The module includes at least a first vacuum orientation chamber, comprising: a vacuum chamber; a transportation track within the vacuum chamber, the transportation track having a support structure and a driving structure and defining a transportation direction; and an orientation actuator to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has two slit openings, particularly two essentially vertically slit openings, at opposing side walls of the vacuum chamber in the transportation direction.

Abstract: A substrate processing system for processing of a plurality of substrates is described. The system includes a first deposition module being a first in-line module and having a first plurality of vacuum deposition sources; a second deposition module being a second in-line module and having a second plurality of vacuum deposition sources; and a glass handling module between the first deposition module and the second deposition module.

Abstract: A vacuum orientation module for a substrate processing system is described. The module includes at least a first vacuum orientation chamber, comprising: a vacuum chamber; a first transportation track within the vacuum chamber, the first transportation track having a first support structure and a first driving structure and defining a transportation direction; an orientation actuator to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has a first pair of two slit openings, particularly essentially vertical slit openings, at opposing side walls of the vacuum chamber in the transportation direction; and a second transportation track within the vacuum chamber, the second transportation track having a second support structure and a second driving structure extending along the transportation direction, the vacuum chamber has a second pair of two slit openings at the opposing side walls of the vacuum chamber.

Abstract: A vacuum processing system for a flexible substrate is provided. The vacuum processing system includes a first chamber adapted for housing a supply roll for providing the flexible substrate; a second chamber adapted for housing a take-up roll for storing the flexible substrate after processing; a substrate transport arrangement including one or more guide rollers for guiding the flexible substrate from the first chamber to the second chamber; a maintenance zone between the first chamber and the second chamber wherein the maintenance zone allows for maintenance access to or of at least one of the first chamber and the second chamber; and a first process chamber for processing the flexible substrate.

Abstract: A vacuum processing system for a flexible substrate is provided. The processing system includes a first chamber adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate; a second chamber adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate; a maintenance zone between the first chamber and the second chamber; and a first process chamber for depositing material on the flexible substrate, wherein the second chamber is provided between the maintenance zone and the first process chamber. The maintenance zone allows for maintenance access to at least one of the first chamber and the second chamber.

Abstract: A positioning arrangement for positioning a substrate carrier and a mask carrier in a vacuum chamber is described. The positioning arrangement comprising a first track extending in a first direction and configured transportation of the substrate carrier configured for holding a substrate having a substrate surface, a second track extending in the first direction and configured for transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface, and a holding arrangement configured for holding the mask carrier, wherein the holding arrangement is arranged between the first track and the second track.

Abstract: Damping valve having a damping valve body with at least one passage channel between two cover sides. An outlet opening of the passage channel leads into a cover-side annular channel which is limited by an outer annular valve support surface and by an inner annular valve support surface, the at least one annular valve support surface for at least one valve disk has a substantially constant width along the circumference, and the annular channel has a varying width along the circumference, and at least one valve support surface has a varying radius of curvature along the circumference.

Abstract: Damping valve having a damping valve body with at least one passage channel between two cover sides. An outlet opening of the passage channel leads into a cover-side annular channel which is limited by an outer annular valve support surface and by an inner annular valve support surface, the at least one annular valve support surface for at least one valve disk has a substantially constant width along the circumference, and the annular channel has a varying width along the circumference, and at least one valve support surface has a varying radius of curvature along the circumference.

Abstract: A vacuum processing system for a flexible substrate is provided. The processing system includes a first chamber adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate; a second chamber adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate; a maintenance zone between the first chamber and the second chamber; and a first process chamber for depositing material on the flexible substrate, wherein the second chamber is provided between the maintenance zone and the first process chamber. The maintenance zone allows for maintenance access to at least one of the first chamber and the second chamber.

Abstract: A deposition arrangement for depositing a material on a substrate is described. The deposition arrangement includes a vacuum chamber; a roller device within the vacuum chamber; and an electrical heating device within the roller device, wherein the heating device comprises a first end and a second end, and wherein the heating device is held at the first end and at the second end. Also, a method for heating a substrate in a vacuum deposition arrangement is described.

Abstract: A sputter apparatus with a pipe cathode is arranged such that the supply of power, cooling fluid and other media to the pipe cathode takes place via flexible lines or tubes which can be wound about a receptor. If the pipe cathode completes a pendulum movement, the lines and/or tubes are wound onto the receptor or wound from it. The pendulum movement of the pipe cathode is preferably such that the pipe cathode is rotated by a certain first angle in a first direction and subsequently by a certain second angle in a second direction, the second angle differing from the first angle. Methods for operating the sputter apparatus are also disclosed.

Abstract: The present invention relates to a method for manufacturing a backside contact of a semiconductor component, in particular, of a solar cell, comprising a metallic layer on the backside of a substrate in a vacuum treatment chamber, and the use of a vacuum treatment system for performing said method. Through this method and its use, in particular silicon based solar cells, can be provided with a back contact in a simple manner in a continuous process sequence, wherein the process sequence can be provided particularly efficient and economical, since no handling systems for rotating the substrate are required, and in particular silk screening steps can be dispensed with.

Abstract: The present invention relates to a coating plant, especially a vacuum coating plant, with a charging lock, especially a rectangular vacuum lock for a coating chamber, with a lock aperture (13) having a length of at least 1000 mm that comprises a shutter (6) for closing and opening the lock aperture and a latch (7) to secure the shutter, wherein there are provided means for moving the shutter and the latch from a first open position to a second closed position, and vice versa, these means assuring also that the movements of the shutter (6) and the latch (7) will be coupled with each other in such manner that the shutter (6) will be automatically secured by the latch (7) after the shutter has been closed and will be released again before it is opened.

Abstract: The invention relates to a vacuum coating installation with a transport system for planar substrates which are transported through a vacuum chamber. This transport system comprises several cylinders disposed in parallel. As the driving means for these cylinders one or several motors may be provided, which are located within or outside of the vacuum chamber. The coupling between the motor or the motors and the cylinders in any event takes place via magnet couplings. Since hereby no mechanical coupling established between the driving means and the cylinders, these can readily be separated from one another, which permits providing the cylinders, and with them the sputter cathodes, in a slide-in element which can be moved into and out of the vacuum chamber. If not every cylinder is provided with its own driving means, the cylinders, which are coupled with a driving means, can be connected via V-belts or the like with the other cylinders.

Abstract: The present invention relates to a coating plant, especially a vacuum coating plant, with a charging lock, especially a rectangular vacuum lock for a coating chamber, with a lock aperture (13) having a length of at least 1000 mm that comprises a shutter (6) for closing and opening the lock aperture and a latch (7) to secure the shutter, wherein there are provided means for moving the shutter and the latch from a first open position to a second closed position, and vice versa, these means assuring also that the movements of the shutter (6) and the latch (7) will be coupled with each other in such manner that the shutter (6) will be automatically secured by the latch (7) after the shutter has been closed and will be released again before it is opened.

Abstract: A sputter apparatus with a pipe cathode is arranged such that the supply of power, cooling fluid and other media to the pipe cathode takes place via flexible lines or tubes which can be wound about a receptor. If the pipe cathode completes a pendulum movement, the lines and/or tubes are wound onto the receptor or wound from it. The pendulum movement of the pipe cathode is preferably such that the pipe cathode is rotated by a certain first angle in a first direction and subsequently by a certain second angle in a second direction, the second angle differing from the first angle. Methods for operating the sputter apparatus are also disclosed.

Abstract: The present invention relates to a coating plant, especially a vacuum coating plant, with a charging lock, especially a rectangular vacuum lock for a coating chamber, with a lock aperture (13) having a length of at least 1000 mm that comprises a shutter (6) for closing and opening the lock aperture and a latch (7) to secure the shutter, wherein there are provided means for moving the shutter and the latch from a first open position to a second closed position, and vice versa, these means assuring also that the movements of the shutter (6) and the latch (7) will be coupled with each other in such manner that the shutter (6) will be automatically secured by the latch (7) after the shutter has been closed and will be released again before it is opened.

Abstract: A multistage lock chamber device with at least two lock chambers, a first pump set for evacuating a first lock chamber, and a second pump set for evacuating a second lock chamber. The first pump set (P1) may evacuate both the first and the second lock chamber, or both jointly. The first pump set may also be utilized as a prior pumping stand of the second pump set. Additionally, an integrated third pump set can be utilized as a pre-pumping stand for the second pump set and/or first pump set. Alternately or additionally, the device can include at least one buffer unit, whose buffer volume is being utilized to produce a sudden decline in pressure inside the lock chamber by means of pressure equalization.

Abstract: Plastic bottles as well as other hollow bodies are given thin functional layers by means of high vacuum coating devices. The relevant process takes place in high vacuum. The bottles to be coated as well as the coated bottles are inserted into a high vacuum chamber (20) through a sluice, which consists of carrousel drum unit. Due to the difference of pressure in the atmosphere and the high vacuum chamber, carrousel within the drum suffers a displacement or tipping, which makes the sealing of the carrousel with respect to the drum difficult. Hence the invention proposes a sluice system consisting of two sluices (23, 25) of the mentioned type, which are connected with one another by means of an intermediate vacuum chamber (22). It is thus achieved that the load due to the pressure on each drum (3) decreases, so that each sluice (23, 25) functions with lesser tendency to develop faults.