Abstract: A hose arrangement (1) having a hose (2), which has at least one bending portion (3) and at least one plug-on portion (4), and at least one connection element (5) onto which the plug-on portion (4) can be or is plugged in a use position, a minimum inside diameter (6) of a cross section of the at least one bending portion (3) being matched to a minimum inside diameter (7) of a cross section of a connecting portion of the at least one connection element (5) or a minimum inside diameter (6) of a cross section of the at least one bending portion (3) not being greater, in particular being smaller, than a minimum inside diameter (7) of a cross section of a connecting portion of the at least one connection element (5).

Abstract: A hose (1) having an inner hose (2) from an uncured, thermoplastic material is produced and the inner hose (2) is thermally expanded.

Abstract: A hose arrangement (1) having a hose (2), which has at least one bending portion (3) and at least one plug-on portion (4), and at least one connection element (5) onto which the plug-on portion (4) can be or is plugged in a use position, a minimum inside diameter (6) of a cross section of the at least one bending portion (3) being matched to a minimum inside diameter (7) of a cross section of a connecting portion of the at least one connection element (5) or a minimum inside diameter (6) of a cross section of the at least one bending portion (3) not being greater, in particular being smaller, than a minimum inside diameter (7) of a cross section of a connecting portion of the at least one connection element (5).

Abstract: In the case of a connector coupling, a rib structure (4) is configured on a hose nipple (3), which rib structure (4) has at least one first rib (5), the at least one first rib (5) extending continuously from a rib start (6) as far as a rib end (7) which is spaced apart axially from said rib start (6), and winding around the hose nipple (3) over a circumferential section of more than 180°, preferably more than 270°, particularly preferably over more than 360° or at least once.

Abstract: The present invention relates to a method for temporarily fixing two planar workpieces, in particular a processed wafer and a carrier wafer. A thin layer is first applied to the sides of the two workpieces that have to be connected, and the coated sides of the workpieces are then connected by means of a bonding agent. Care should be taken that the thin layers can preferably be applied easily and removed without leaving any residues. The bonding agent, which actually causes the bond, needs only be selected with respect to its chemical resistance and its mechanical and adhesive properties.

Abstract: A mechanism for the contactless gripping and positioning of a component having a planar peripheral edge region, including a sound producing device producing a pattern of levitation sound waves for keeping the component in suspension at a selected position. The sound producing device is configured wherein only the peripheral edge region of the component lies in the sound wave pattern to be acted upon thereby and is fixed in the sound wave pattern by Bernoulli forces. The total surface area of the sound producing device is less than the component's total surface area facing the sound producing device.

Abstract: A handler for transporting planar substrates, in particular wafers, used in the semiconductor industry, between at least two stations. The handler includes a movable flat support arm for receiving a substrate and means for defining the location of the substrate in the area of a predetermined point on the support arm. A vibration generator for generating a longitudinal ultrasonic vibration is provided, that the vibration generator interacts with the support arm in such a way that a substantially stationary vibration with at least one antinode can be set on the flat support arm, which permits a levitation of a substrate placed thereon. A means for defining the location of the substrate provide a lateral positioning exclusively by an interaction with the edge area of a substrate.

Abstract: The proposal is for a handler for the transporting of flat substrates, in particular or wafers (9) for application in the semi-conductor industry between at least two stations with a mobile planar carrying arm (6) for taking up a substrate as well as the means for layering information of the substrate in the area of a pre-given place on the carrying arm (6). The invention is based on the task of avoiding detrimental effect to the underside of a substrate during layer positioning and the generation of particles on layer positions.