Patents by Inventor Jurgen Markus Suss
Jurgen Markus Suss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11955339Abstract: A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.Type: GrantFiled: December 14, 2021Date of Patent: April 9, 2024Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20230230871Abstract: The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.Type: ApplicationFiled: July 8, 2020Publication date: July 20, 2023Applicant: EV Group E. Thallner GmbHInventors: Jurgen Markus Suss, Jurgen Mallinger
-
Publication number: 20230207379Abstract: A substrate holder for curving a substrate the substrate holding including a fixing plate for fixing the substrate, curving means for curving the fixing plate, wherein the fixing plate is constituted such that the curvature of the substrate can be adjusted in a targeted manner, as well as a corresponding method.Type: ApplicationFiled: June 29, 2020Publication date: June 29, 2023Applicant: EV Group E. Thallner GmbHInventors: Dominik ZINNER, Thomas WAGENLEITNER, Jürgen Markus SÜSS, Thomas PLACH, Jürgen MALLINGER
-
Patent number: 11527410Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: January 4, 2022Date of Patent: December 13, 2022Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 11488851Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.Type: GrantFiled: January 29, 2021Date of Patent: November 1, 2022Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
-
Publication number: 20220173068Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.Type: ApplicationFiled: February 15, 2022Publication date: June 2, 2022Applicant: EV Group E. Thallner GmbHInventors: Dominik ZINNER, Thomas WAGENLEITNER, Jurgen Markus SUSS, Thomas PLACH, Jurgen MALLINGER
-
Publication number: 20220130674Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: January 4, 2022Publication date: April 28, 2022Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 11315901Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.Type: GrantFiled: September 21, 2017Date of Patent: April 26, 2022Assignee: EV Group E. Thallner GmbHInventors: Dominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Thomas Plach, Jurgen Mallinger
-
Publication number: 20220102146Abstract: A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.Type: ApplicationFiled: December 14, 2021Publication date: March 31, 2022Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 11282706Abstract: A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.Type: GrantFiled: April 17, 2019Date of Patent: March 22, 2022Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 11251045Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: November 4, 2020Date of Patent: February 15, 2022Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20220026196Abstract: The invention relates to a measuring device for determining a course of a bonding wave in a gap (3) between a first substrate (2) and a second substrate (4). Furthermore, the present invention relates to a corresponding method.Type: ApplicationFiled: January 18, 2019Publication date: January 27, 2022Applicant: EV Group E. Thallner GmbHInventors: Dominik ZINNER, Jürgen MALLINGER, Thomas PLACH, Boris POVAZAY, Harald ROHRINGER, Jürgen Markus SÜSS
-
Publication number: 20210151339Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.Type: ApplicationFiled: January 29, 2021Publication date: May 20, 2021Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
-
Patent number: 10991609Abstract: A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.Type: GrantFiled: August 12, 2016Date of Patent: April 27, 2021Assignee: EV GROUP E. THALLNER GMBHInventors: Dominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Jurgen Mallinger, Thomas Plach
-
Publication number: 20210074544Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: November 4, 2020Publication date: March 11, 2021Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 10943807Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.Type: GrantFiled: March 26, 2020Date of Patent: March 9, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
-
Patent number: 10861699Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: July 8, 2020Date of Patent: December 8, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20200335341Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: July 8, 2020Publication date: October 22, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Patent number: 10748770Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: March 17, 2020Date of Patent: August 18, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
-
Publication number: 20200227299Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.Type: ApplicationFiled: March 26, 2020Publication date: July 16, 2020Applicant: EV Group E. Thallner GmbHInventors: Thomas WAGENLEITNER, Dominik ZINNER, Jurgen Markus SUSS, Christian SINN, Jurgen MALLINGER