Abstract: A method and device for wet treating a peripheral area of a wafer-shaped article uses rollers for driving the wafer-shaped article at its edge. First and second liquid treatment units supply liquid towards the peripheral area. Each of the liquid treatment units comprises a liquid carrier, a liquid supply nozzle for supplying liquid to the liquid carrier and a liquid discharging channel for removing liquid from the liquid carrier. The second liquid treatment unit includes a gas treatment section with a gas supply nozzle for removing most of the second liquid from the peripheral area, and with a gas discharge channel for discharging gas and removed liquid.

Abstract: A device for wet treating a peripheral area of a wafer-shaped article includes holding elements for holding and rotating the wafer-shaped article at its edge, a first and a second liquid treatment units for supplying liquid towards the peripheral area. The holding elements include rollers for driving the wafer-shaped article at its edge. The first liquid treatment unit includes a first liquid carrier for providing a first liquid to wet a first section of the peripheral area, a first liquid supply nozzle for supplying liquid to the first liquid carrier, and a first liquid discharging channel for removing liquid from the first liquid carrier.