Abstract: The invention relates to a method for producing substrates having a plasma coated surface made of a dielectric coating material in a vacuum chamber, having an AC-powered plasma device, comprising moving a substrate relative to the plasma device by means of a movement device along a curve, and depositing coating material on a surface of the substrate in a coating region along a trajectory lying on the surface of the substrate using the plasma device.

Abstract: A method for reducing the optical loss of the multilayer coating below a predetermined value in a zone by producing coating on a displaceable substrate in a vacuum chamber with the aid of a residual gas using a sputtering device. Reactive depositing a coating on the substrate by adding a reactive component with a predetermined stoichiometric deficit in a zone of the sputtering device. Displacing the substrate with the deposited coating into the vicinity of a plasma source, which is located in the vacuum chamber at a predetermined distance from the sputtering device. The plasma action of the plasma source modifying the structure and/or stoichiometry of the coating, preferably by adding a predetermined quantity of the reactive component to reduce the optical loss of the coating.

Abstract: The invention relates to a method for producing substrates having a plasma coated surface made of a dielectric coating material in a vacuum chamber, having an AC-powered plasma device, comprising moving a substrate relative to the plasma device by means of a movement device along a curve, and depositing coating material on a surface of the substrate in a coating region along a trajectory lying on the surface of the substrate using the plasma device.

Abstract: The invention relates to an apparatus (1) for producing a reflection-reducing layer on a surface (21) of a plastics substrate (20). The apparatus comprises a first sputtering device (3) for applying a base layer (22) to the surface (21) of the plastics substrate (20), a plasma source (4) for plasma-etching the coated substrate surface (21), and a second sputtering device (5) for applying a protective layer (24) to the substrate surface (21). These processing devices (3, 4, 5) are arranged jointly in a vacuum chamber (2), which has inlets (8) for processing gases. In order to move the substrate (20) between the processing devices (3, 4, 5) in the interior of the vacuum chamber (2), a conveying apparatus (10) is provided which is preferably in the form of a rotary table (11). Furthermore, the invention relates to a method for producing such a reflection-reducing layer on the surface (21) of the plastics substrate (20).

Abstract: The invention relates to an apparatus for the vacuum treatment of substrates (130), comprising a vacuum chamber (1) having a plasma device (160) of a process chamber (110) and a holding device (135) for substrates (130), which is arranged in the process chamber (110), underneath the plasma device, wherein the process chamber (110) comprises an upper subsection (105a) having a side wall (106a) and a lower subsection (105b) having a side wall (106b), and the upper subsection (105a) and the lower subsection (105b) can be moved vertically relative to each other. According to the invention between the side wall (106a) of the upper subsection (105a) and the side wall (106b) of the lower subsection (105b), a lower flow path (105c) extends between the inner region (140) of the process chamber (110) and the inner region (1a) of the vacuum chamber (1) that is arranged outside the upper subsection (105a).

Abstract: A method for reducing the optical loss of the multilayer coating below a predetermined value in a zone by producing coating on a displaceable substrate in a vacuum chamber with the aid of a residual gas using a sputtering device. Reactive depositing a coating on the substrate by adding a reactive component with a predetermined stoichiometric deficit in a zone of the sputtering device. Displacing the substrate with the deposited coating into the vicinity of a plasma source, which is located in the vacuum chamber at a predetermined distance from the sputtering device. The plasma action of the plasma source modifying the structure and/or stoichiometry of the coating, preferably by adding a predetermined quantity of the reactive component to reduce the optical loss of the coating.

Abstract: A method for reducing the optical loss of the multilayer coating below a predetermined value in a zone by producing coating on a displaceable substrate in a vacuum chamber with the aid of a residual gas using a sputtering device. Reactive depositing a coating on the substrate by adding a reactive component with a predetermined stoichiometric deficit in a zone of the sputtering device. Displacing the substrate with the deposited coating into the vicinity of a plasma source, which is located in the vacuum chamber at a predetermined distance from the sputtering device. The plasma action of the plasma source modifying the structure and/or stoichiometry of the coating, preferably by adding a predetermined quantity of the reactive component to reduce the optical loss of the coating.

Abstract: The invention relates to an apparatus (1) for producing a reflection-reducing layer on a surface (21) of a plastics substrate (20). The apparatus comprises a first sputtering device (3) for applying a base layer (22) to the surface (21) of the plastics substrate (20), a plasma source (4) for plasma-etching the coated substrate surface (21), and a second sputtering device (5) for applying a protective layer (24) to the substrate surface (21). These processing devices (3, 4, 5) are arranged jointly in a vacuum chamber (2), which has inlets (8) for processing gases. In order to move the substrate (20) between the processing devices (3, 4, 5) in the interior of the vacuum chamber (2), a conveying apparatus (10) is provided which is preferably in the form of a rotary table (11).—Furthermore, the invention relates to a method for producing such a reflection-reducing layer on the surface (21) of the plastics substrate (20).

Abstract: A plasma source generates a plasma beam that is extracted from a plasma generated by electric and magnetic fields. An RF electrode device includes an excitation electrode having an excitation area, and a plasma space is arranged between extraction electrode and excitation area. The plasma, relative to the extraction electrode is at a higher potential which accelerates positive plasma ions, and the plasma and the extracted plasma beam are influenced by a magnetic field. At least one magnet north pole and one magnetic south pole generate the magnetic field. Each are arranged such that a curved magnetic field projecting into the interior of the plasma space is formed. At least one of the north or south poles is embodied in elongate fashion to form a tunnel-like region in the plasma, in which charged particles are held and along which the latter can propagate.

Abstract: In the method for producing a layer system on a dielectric substrate in which a metal layer is applied onto the substrate by a coating step (110) and a further layer with a predetermined layer thickness is subsequently applied by a further coating step (140), the metal layer having a sheet resistance >10 Mohm and an average reflectance >50%, the further layer would have a sheet resistance <1 Mohm if it had been applied onto the substrate with the same layer thickness by the further coating step (140), and the layer system consisting of the metal layer and the further layer has a sheet resistance >10 Mohm, where the invention furthermore relates to a layer system on a dielectric substrate in which a metal layer is applied onto the substrate by a coating step (110) and a further layer with a predetermined layer thickness is subsequently applied by a further coating step (140), the metal layer having a sheet resistance >10 Mohm and an average reflectance >50%, where the further layer, if it had

Abstract: A method for generating a plasma beam and a plasma source for carrying out the method, where the plasma beam is extracted from a plasma generated by electric and magnetic fields by means of a radiofrequency voltage being applied to an extraction electrode and an RF electrode device having an excitation electrode having an excitation area, where a plasma space is arranged between extraction electrode and excitation area and the plasma, relative to the extraction electrode, on average over time, is at a higher potential which accelerates positive plasma ions, and the plasma and the extracted plasma beam are influenced by a magnetic field, it is provided that at least one magnet north pole and one magnetic south pole are used for generating the magnetic field, which in each case are arranged on a side facing away from the plasma behind the excitation electrode and are directed into the interior of the plasma space, such that a curved magnetic field projecting into the interior of the plasma space is formed, and

Abstract: A method for producing one or more coating on a displaccable substrate in a vacuum chamber with the aid of a residual gas, by means of a sputtering device said coating being formed from at least two constituents, whereby a sputtering material of the sputtering device constitutes at least one first constituent and a reactive component of the residual gas constitutes a second constituent.