Patents by Inventor Jurgen Portmann

Jurgen Portmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated electronic component and production method
    Patent number: 7388281
    Abstract: The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: June 17, 2008
    Assignee: EPCOS AG
    Inventors: Hans Krueger, Jürgen Portmann, Karl Nicolaus, Gregor Feiertag, Alois Stelzl
  • Encapsulated electronic component and production method
    Publication number: 20060151203
    Abstract: The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections.
    Type: Application
    Filed: June 23, 2003
    Publication date: July 13, 2006
    Inventors: Hans Krueger, Jurgen Portmann, Karl Nicolaus, Gregor Feiertag, Alois Stelzl
  • Encapsulated component which is small in terms of height and method for producing the same
    Patent number: 6982380
    Abstract: For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: January 3, 2006
    Assignee: Epcos AG
    Inventors: Christian Hoffmann, Jürgen Portmann, Hans Krueger
  • Encapsulated component which is small in terms of height and method for producing the same
    Publication number: 20050034888
    Abstract: For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.
    Type: Application
    Filed: December 11, 2002
    Publication date: February 17, 2005
    Inventors: Christian Hoffmann, Jurgen Portmann, Hans Krueger