Abstract: Example embodiments relate to packaged electronic devices. One example packaged electronic device includes a substrate. The packaged electronic device also includes a plurality of leads fixated relative to the substrate in a spaced apart manner. Additionally, the packaged electronic device includes a solidified molding compound that is fixedly connected to the plurality of leads. The solidified molding includes an upper ring part that extends away from the leads in a direction away from the substrate. Further, the packaged electronic device includes an electronic component mounted on the substrate and electrically connected to the leads. In addition, the packaged electronic device includes a lid having a lid base and a lid rim that extends towards the upper ring part. The lid rim is connected to the upper ring part using an adhesive. Each of the lid rim and upper ring part include an inner portion and an outer portion.

Abstract: Example embodiments relate to an electronic package, to an electronic device comprising such a package, and to a lead frame for manufacturing the electronic package. Some examples may particularly relate to electronic packages in which radiofrequency (RF) circuitry is arranged. According to the example embodiments, a width of the clamping portion is substantially larger than the width of the lead end portion, the width of the clamping portion being chosen such that bending of the inner part and/or body part relative to the outer part during the application of the molding compound was substantially prevented thereby having avoided flash and/or bleed of molding compound onto the inner part.

Abstract: Example embodiments relate to electronic packages and electronic devices that include the same. One embodiment includes an electronic package. The electronic package includes a package body. The electronic package also includes a heat-conducting substrate arranged inside the package body and having a bottom surface that is exposed to an outside of the package body. Additionally, the electronic package includes an electronic circuit arranged inside the package body and including a semiconductor die that has a bottom surface with which it is mounted to the heat-conducting substrate and an opposing upper surface. Further, the electronic package includes one or more leads partially extending from outside the package body to inside the package body and over the minimum bounding box, each lead having a first end that is arranged inside the package body. In addition, the electronic package includes one or more bondwires for connecting the first end(s) to the electronic circuit.

Abstract: Example embodiments relate to lead frame based molded radio frequency packages. One example package includes a substrate. The package also includes a first electrical component arranged on the substrate. Additionally, the package includes a second electrical component. Further, the package includes a plurality of leads that are arranged spaced apart from the substrate and fixed in position relative thereto by a solidified molding compound. The leads were part of a lead frame prior to separating the package from the lead frame. The substrate was physically and electrically connected to the lead frame using a plurality of spaced apart connecting members prior to separating the package from the lead frame. During the separating of the package from the lead frame, each connecting member was divided into a first connecting member part and a second connecting member part. In addition, the package includes a frame part.

Abstract: Example embodiments relate to an electronic package, to an electronic device comprising such a package, and to a lead frame for manufacturing the electronic package. Some examples may particularly relate to electronic packages in which radiofrequency (RF) circuitry is arranged. According to the example embodiments, a width of the clamping portion is substantially larger than the width of the lead end portion, the width of the clamping portion being chosen such that bending of the inner part and/or body part relative to the outer part during the application of the molding compound was substantially prevented thereby having avoided flash and/or bleed of molding compound onto the inner part.

Abstract: Example embodiments relate to packaged electronic devices. One example packaged electronic device includes a substrate. The packaged electronic device also includes a plurality of leads fixated relative to the substrate in a spaced apart manner. Additionally, the packaged electronic device includes a solidified molding compound that is fixedly connected to the plurality of leads. The solidified molding includes an upper ring part that extends away from the leads in a direction away from the substrate. Further, the packaged electronic device includes an electronic component mounted on the substrate and electrically connected to the leads. In addition, the packaged electronic device includes a lid having a lid base and a lid rim that extends towards the upper ring part. The lid rim is connected to the upper ring part using an adhesive. Each of the lid rim and upper ring part include an inner portion and an outer portion.

Abstract: Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to keep the space above the sensitive surface of the chip free during the encapsulation process, closing the mould with a second mould part, introducing the package material into the closed mould and providing the circumstances to let the package cure. The method also including applying a closed dam of heat resistant material around the sensitive chip area and placing a lid on the dam such that space above the sensitive area enclosed by the dam and the lid is sealed.

Abstract: Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes: