Abstract: A component handling device for component handling in working or process machines, in particular injection moulding machines, comprises a basic linear axis running outside or inside the handling space of the handling device, a multi-axis arrangement, which is translationally displaceable on the basic linear axis, with a main rotational axis orthogonal to the basic linear axis, a secondary rotational axis directed parallel thereto and linked to the main rotational axis via a first robot arm, which guides a second robot arm pivotably over the handling space, and a vertical linear axis linked to the second robot arm eccentrically to the secondary rotational axis, and a gripping device linked to the vertical linear axis for a component to be handled.

Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.

Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.

Abstract: The invention relates to a method for modifying the operating mode of a technical communications group platform (TCGPL) of a telecommunications network (TC network) for at least one driving object 1 which is controlled by a subscriber object (SUBC), by modifying by means of at least one modifying object 2 the operating mode of at least one object 3 which is to be modified or has been modified, and a telecommunications group platform (TCGPL) for producing technical communications group processes (TCGPs). The invention further relates to a method for managing technical communications group processes (TCGPs) with the steps: provision of a driving object which defines at least one further object to be provided; making available of at least one modifying object for the provision of the further object defined by the driving object; generation of an algorithm from the modifying object; and provision of the further object by execution of the algorithm.

Abstract: The invention relates to a method for modifying the operating mode of a technical communications group platform (TCGPL) of a telecommunications network (TC network) for at least one driving object 1 which is controlled by a subscriber object (SUBC), by modifying by means of at least one modifying object 2 the operating mode of at least one object 3 which is to be modified or has been modified, and a telecommunications group platform (TCGPL) for producing technical communications group processes (TCGPs). The invention further relates to a method for managing technical communications group processes (TCGPs) with the steps: provision of a driving object which defines at least one further object to be provided; making available of at least one modifying object for the provision of the further object defined by the driving object; generation of an algorithm from the modifying object; and provision of the further object by execution of the algorithm.

Abstract: The invention relates to a method for modifying the operating mode of a technical communications group platform (TCGPL) of a telecommunications network (TC network) for at least one driving object 1 which is controlled by a subscriber object (SUBC), by modifying by means of at least one modifying object 2 the operating mode of at least one object 3 which is to be modified or has been modified, and a telecommunications group platform (TCGPL) for producing technical communications group processes (TCGPs). The invention further relates to a method for managing technical communications group processes (TCGPs) with the steps: provision of a driving object which defines at least one further object to be provided; making available of at least one modifying object for the provision of the further object defined by the driving object; generation of an algorithm from the modifying object; and provision of the further object by execution of the algorithm.

Abstract: Lipopolysaccharides and processes for producting the lipopolysaccharides are provided. The lipopolysaccharide has a lipid A portion, a core oligosaccharide portion, and an O-specific chain having a single repeating unit 06. A lipopolysaccharide may be produced by washing and drying and E. coli bacterial mass, subjecting the washed and dried bacterial mass to a phenol/water extraction, and treating the extract with RNases, DNases, and proteinase K.

Abstract: Lipopolysaccharides and processes for producting the lipopolysaccharides are provided. The lipopolysaccharide has a lipid A portion, a core oligosaccharide portion, and an O-specific chain having a single repeating unit 06. A lipopolysaccharide may be produced by washing and drying and E. coli bacterial mass, subjecting the washed and dried bacterial mass to a phenol/water extraction, and treating the extract with RNases, DNases, and proteinase K.

Abstract: Methods for identifying Escherichia coli strain DSM 6601 and nucleotide sequences associated therewith.

Abstract: Soft solder powder is made in the form of spherical fine metal particles having a grain size ranging from 1 to 100 &mgr;m and a Liquidus temperature <250° C.

Abstract: Soft solder powder is made in the form of spherical fine metal particles having a grain size ranging from 1 to 100 &mgr;m and a Liquidus temperature <250° C.

Abstract: A method is disclosed for encapsulating solder metal powders and the microencapsulated metal solder in such a way that the metal powder is reliably protected from external oxidizing influences and the capsule only releases the metal powder as a result of the influence of temperature, without the influence of soldering flux.

Abstract: E. coli plasmids pMUT 1 and pMUT 2 containing DNA sequences exhibiting significant homologies to reduplicaton starting positions of other enterobacterial plasmids are disclosed. Also disclosed are expression vectors containing plasmicis pMUT1 and pMUT 2.

Abstract: The invention relates to DNA sequences from fimbrial gene clusters of Escherichia coli strain DSM 6601. This strain has two chromosomal fimbrial gene clusters, namely type I (fim) and FIC (foc) gene clusters. DNA sequences of the main subunits fimA and focA are represented by SEQ ID NOS: 1 and 2.

Abstract: The invention relates to a method and device for producing soft solder powder without pressure, in particular for producing spherical fine metal particles having a grain size ranging from 1-100 microns and a liquidus temperature <250 degrees C.

Abstract: A ribbon cassette for electronically controlled typewriters or similar machines equipped with a signal generator, the ribbon cassette being disposed on a carriage moveable along the platen. The present invention is also directed to the combination of such a ribbon cassette with such a machine.

Abstract: A procedure for the production of granulated food, applicable especially to the production of granulated baby and infant food, such as infant food most analogously resembling mother's milk is disclosed. The process provides a new composition of matter consisting of a stable, well dosable, granulated food product, of defined formula, which after reconstitution does not cream up, and which, in the case of the closest approach to the composition of mother's milk, will inhibit intestinal putrefaction. In the process, selected pulverized components are fed into a fluidized bed granulator and remaining fluidized components are sprayed simultaneously, successively or in mixtures, at a product temperature of 30.degree. to 80.degree. C. whereby granulates are obtained. The granulates are dried in the fluidized bed and cooled with air.

Abstract: A device for use in a tape cassette recorder preventing the accidental erasing of a magnetic tape contained in a tape cassette which includes a toggle lever for scanning the recess of the cassette which is engageable with a slide of a push button activator in such a manner that the toggle lever can arrest the movement of the slide depending on whether the recess is accessible or not.