Abstract: An electronic measuring instrument encompasses a sensor for the acquisition of process variables, a main memory for the operating parameters of the measuring instrument as well as several additional memory blocks for at least part of the operating parameters of the measuring instrument: The additional memory blocks includes a first memory block which serves to store active operating parameters, a second memory block for storing delivered preset operating parameters and a third memory block for storing application-specific operating parameters. An electronic measuring instrument of this design allows the user to access different versions of the operating parameters, enabling him for instance in the event of a failure or upon exchanging a component of the measuring instrument to activate the respectively appropriate version of operating parameters. A method for operating the instrument is also disclosed.

Abstract: Described and illustrated is an electronic measuring instrument as well as a method for operating an electronic measuring instrument. The electronic measuring instrument encompasses a sensor for the acquisition of process variables, a main memory for the operating parameters of the measuring instrument as well as several additional memory blocks for at least part of the operating parameters of the measuring instrument, of which additional memory blocks the first memory block serves to store active operating parameters. An additional second memory block is provided for storing delivered preset operating parameters and a third memory block is provided for storing application-specific operating parameters. An electronic measuring instrument of this design allows the user to access different versions of the operating parameters, enabling him for instance in the event of a failure or upon exchanging a component of the measuring instrument to activate the respectively appropriate version of operating parameters.

Abstract: An optoelectronic keypad and a method for controlling an optoelectronic keypad for a measuring instrument, require a transparent touch screen, at least two touch-sensitive control buttons, at least two light emitters and at least two photodetectors, where said control buttons are located next to each other on one side of the surface of the touch-screen, the light emitters and the photodetectors are situated next to each other on the other side of the touch screen and each one control button, light emitter and photodetector are functionally associated with one another in a way as to constitute one action key, whereby pressing the control button of an action key causes the light emanating from the light emitter of that action key to be reflected at the actuated key and to impinge on the photodetector of that key.

Abstract: A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the diameter of the contacts.

Abstract: A microelectronic element is with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.

Abstract: A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.

Abstract: A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the diameter of the contacts.

Abstract: An optoelectronic keypad and a method for controlling an optoelectronic keypad for a measuring instrument, require a transparent touch screen, at least two touch-sensitive control buttons, at least two light emitters and at least two photodetectors, where said control buttons are located next to each other on one side of the surface of the touch-screen, the light emitters and the photodetectors are situated next to each other on the other side of the touch screen and each one control button, light emitter and photodetector are functionally associated with one another in a way as to constitute one action key, whereby pressing the control button of an action key causes the light emanating from the light emitter of that action key to be reflected at the actuated key and to impinge on the photodetector of that key.

Abstract: A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on the flexible film can urge the components together during bonding. Temporary securements such as adhesive bonds between the microelectronic element and the component can hold the microelectronic element in place relative to the component while electrical connections are made by conductive bonding material such a solder.

Abstract: A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on the flexible film can urge the components together during bonding. Temporary securements such as adhesive bonds between the microelectronic element and the component can hold the microelectronic element in place relative to the component while electrical connections are made by conductive bonding material such a solder.