Abstract: The invention concerns a process for the production of a conductor track structure on a flexible plastic film, a conductor track structure produced in accordance therewith, wherein the conductor track structure is connected to the plastic film by means of an adhesive layer hardened by irradiation, and is formed from an electrically conducting thin film layer in pattern form, which is galvanically reinforced with at least one metal layer, as well as an electronic component or an electronic circuit having such a conductor track structure.

Abstract: Described is a transfer film, in particular a hot embossing film, which includes a carrier film (22) and a transfer layer portion having a structure layer (14), the transfer layer portion being arranged on the carrier film (22) and being detachable from the carrier film (22). It is provided that the carrier film (22) has a master relief structure (22m) on its side towards the structure layer (14), the structure layer (14) on its side towards the carrier film (22) has a first relief structure (14o) complementary to the master relief structure (22m) of the carrier film (22), the structure layer (14) on its side remote from the carrier film (22) has a second relief structure (14u) which differs from the first relief structure (14o), and the second relief structure (14u) is covered at least region-wise with a reflection layer (16). There are further provided a process for the production of the transfer film, a multi-layer body formed with the structure layer and a security document having the multi-layer body.