Abstract: A method for building a device having fluidic and electrical functions includes the steps of: mounting a building part with fluidic and electrical functions on a substrate that is provided with a fluidic circuit; fluidically connecting the building part with the substrate; electrically connecting the building part with the substrate; and mechanically connecting the building part with the substrate. Flip-chip technology is utilized and a seal is made by of a gasket. With such a method, a hybrid microfluidic system can be built in which materials and processes for realizing the various connections (fluidic and mechanical and electrical) can be selected in principle independently of each other so the individual processes can be optimized independently of each other in a large measure. With the application of flip-chip technology, great accuracy in the positioning of the building parts can be achieved.

Abstract: A method for building a device having fluidic and electrical functions, comprising: mounting a building part with fluidic and electrical functions on a substrate that is provided with a fluidic circuit; fluidically connecting the building part with the substrate; electrically connecting the building part with the substrate; and mechanically connecting the building part with the substrate, wherein use is made of flip-chip technology; and a seal is made by means of a gasket. With such a method a hybrid microfluidic system can be built in which materials and processes for realizing the various connections (fluidic and mechanical and electrical) can be selected in principle independently of each other so the individual processes can be optimized independently of each other in a large measure. With the application of flip-chip technology, great accuracy in the positioning of the building parts can be achieved. The electrical connection is made by means of a current material and a well-developed process.