Patents by Inventor Jurriaan Gerretsen

Jurriaan Gerretsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dip formation of flip-chip solder bumps
    Patent number: 6551650
    Abstract: A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetting metal pad (52). The composite substrate (20) is then dipped or otherwise immersed into a reservoir of liquid solder (106). Next, the composite substrate (20) is redrawn (116), or otherwise removed, from the liquid solder to form solder bumps (113) on the at least one metal wetting pad (52).
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: April 22, 2003
    Assignee: Corning Incorporated
    Inventors: Alain R. Carre, Jurriaan Gerretsen
  • Exhaust device for a turbine engine
    Patent number: 6257366
    Abstract: The invention relates to an exhaust device for a turbine engine, comprising a liner made of a fiber-reinforced ceramic matrix composite. The liner is preferably fitted some distance away from the inside of the exhaust section. The liner has a thickness of 1 to 10 mm, preferably of 2 to 6 mm. There is a gap of at least 10 mm, preferably 10 to 40 mm, between the liner and the inside of the exhaust.
    Type: Grant
    Filed: July 20, 1998
    Date of Patent: July 10, 2001
    Assignee: Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek
    Inventors: Jurriaan Gerretsen, Yvette Gertrude Roman, Everhardus Gerretsen