Patents by Inventor Jury Isaevich Moldovanov

Jury Isaevich Moldovanov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid high-power microwave-frequency integrated circuit
    Patent number: 6057593
    Abstract: In a power microwave hybrid integrated circuit, a depth of recesses (2) in a metal base (1) is selected so that a face surface of chips (3) and a metal base (1) are coplanar, a dielectric board (5) has a shield ground metallization (10) on its back side at the places adjoining the metal base (1), the metal base (1) is sealingly joined and electrically connected to the shield grounding metallization (10) of the board (5), and interconnecting holes (7) of the board (5) are filled with an electrically conducting material (9), the spacing between the side surfaces of the chips (3) and the side surfaces of the recesses (2) in the base (1) being of 0.001 to 0.2 mm.
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: May 2, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Viktor Anatolievich Iovdalsky, Jury Isaevich Moldovanov