Patents by Inventor Jusirou Eguchi

Jusirou Eguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for flexible printed wiring board and method for manufacturing the same
    Patent number: 7384683
    Abstract: The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 ?m and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: June 10, 2008
    Assignees: Unitika Ltd., Nippon Kayaku Kabushiki Kaisha
    Inventors: Yoshiaki Echigo, Jusirou Eguchi, Akira Shigeta, Makoto Uchida, Shigeru Moteki
  • Substrate for flexible printed wiring board and method for manufacturing the same
    Publication number: 20070071984
    Abstract: The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 ?m and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.
    Type: Application
    Filed: September 10, 2004
    Publication date: March 29, 2007
    Inventors: Yoshiaki Echigo, Jusirou Eguchi, Akira Shigeta, Makoto Uchida, Shigeru Moteki