Patents by Inventor Justin Allen Payne
Justin Allen Payne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230147440Abstract: The present disclosure is related to an occlusion device having a mesh structure. The occlusion device configured to transition between a two-dimensional configuration and a three-dimensional configuration. In the two-dimensional configuration and at rest, the occlusion device is flat or planar. In the three-dimensional configuration, the occlusion device defines an internal volume.Type: ApplicationFiled: October 27, 2022Publication date: May 11, 2023Inventors: Philip Mauger, Michael Williamson, Mark Alan Adler, Justin Allen Payne
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Patent number: 11517321Abstract: The present disclosure is related to an occlusion device having a mesh structure. The occlusion device configured to transition between a two-dimensional configuration and a three-dimensional configuration. In the two-dimensional configuration and at rest, the occlusion device is flat or planar. In the three-dimensional configuration, the occlusion device defines an internal volume.Type: GrantFiled: May 25, 2017Date of Patent: December 6, 2022Assignee: Nanostructures, Inc.Inventors: Philip Mauger, Michael Williamson, Mark Alan Adler, Justin Allen Payne
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Publication number: 20210275189Abstract: The present disclosure is related to an occlusion device having a mesh structure. The occlusion device configured to transition between a two-dimensional configuration and a three-dimensional configuration. In the two-dimensional configuration and at rest, the occlusion device is flat or planar. In the three-dimensional configuration, the occlusion device defines an internal volume.Type: ApplicationFiled: May 25, 2017Publication date: September 9, 2021Inventors: Philip Mauger, Michael Williamson, Mark Alan Adler, Justin Allen Payne
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Publication number: 20200323539Abstract: The present disclosure is related to an occlusion device having a mesh structure. The occlusion device configured to transition between a two-dimensional configuration and a three-dimensional configuration. In the two-dimensional configuration and at rest, the occlusion device is flat or planar. In the three-dimensional configuration, the occlusion device defines an internal volume.Type: ApplicationFiled: May 25, 2017Publication date: October 15, 2020Inventors: Philip Mauger, Michael Williamson, Mark Alan Adler, Justin Allen Payne
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Patent number: 8908255Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.Type: GrantFiled: March 12, 2012Date of Patent: December 9, 2014Assignee: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
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Publication number: 20120171623Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.Type: ApplicationFiled: March 12, 2012Publication date: July 5, 2012Applicant: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
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Patent number: 8159740Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.Type: GrantFiled: January 20, 2010Date of Patent: April 17, 2012Assignee: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
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Publication number: 20100112492Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.Type: ApplicationFiled: January 20, 2010Publication date: May 6, 2010Applicant: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
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Patent number: 7675670Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300 ° C. to maintain a state of the planarizing material.Type: GrantFiled: June 5, 2006Date of Patent: March 9, 2010Assignee: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, Howard Woo
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Patent number: 7522330Abstract: An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.Type: GrantFiled: June 5, 2006Date of Patent: April 21, 2009Assignee: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, William Spencer Worley, III, Dongmin Chen, Howard Woo
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Publication number: 20090002805Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.Type: ApplicationFiled: September 12, 2008Publication date: January 1, 2009Applicant: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, William Spencer Worley, III, Dongmin Chen, Howard Woo
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Patent number: 7453624Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.Type: GrantFiled: June 5, 2006Date of Patent: November 18, 2008Assignee: Miradia Inc.Inventors: Xiao Yang, Yuxiang Wang, Wook Ji, Justin Allen Payne, Ye Wang, William Spencer Worley, III, Dongmin Chen, Howard Woo