Abstract: Electrically conductive sheet material preforms useful in bonding of electronic components as well as in the formation of electronic circuits are disclosed. The preforms, which comprise a multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive, are particularly useful in the assembly of multi-chip modules and multilayer electronic devices.

Abstract: Electrically conductive sheet material preforms useful in bonding of electronic components as well as in the formation of electronic circuits are disclosed. The preforms, which comprise a multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive, are particularly useful in the assembly of multi-chip modules and other electronic devices.

Abstract: A flexible circuit film is used in a surface mountable pre-formed chip carrier cavity package as a direct interconnect between the integrated circuit chip and external bonding pads on a printed circuit board. The IC chip carrier of the present invention is comprised of a square or rectangular base having a central cavity; an IC chip mounted in the cavity and held therein by an adhesive; a lid having a complementary shape to the upper surface of the base; and a flexible circuit sheet sandwiched between the base and lid. The flexible circuit conforms to the top surface of the base due to various cuts or cutouts therein depending upon the specific package construction. Etched copper circuitry on the flex circuit forms interconnects between I/O pads on the IC chip and the outer periphery of the package. The package enables the use of more than 80 and up to more than 300 I/O leads per chip. The base, circuit film, and lid are bonded together with a suitable adhesive.

Abstract: Novel thermoplastic curing agents formed by reacting an imidazole compound with an epoxy resin, and with--optionally as a third reactant--polyfunctional proton-donating compounds like polybasic acids or phenolic novolac resins. The curing agents are extraordinary in that they are useful in formulating novel storeable, one-package, heat-curable epoxy resin-based compositions. Moreover, they react synergistically with known curing agents, most notably dicyandiamid. The cured materials are of excellent quality. Processes, whereby the various novel materials of the invention are made, are also described.