Abstract: Techniques for constructing a multi-chip module semiconductor device are provided herein. The techniques include placing electronic modules on a first surface and a second surface, with electrical connections for the electronic modules being proximate to respectively mounted surfaces, disposing a mold material on one of the mounting surfaces to substantially surround corresponding electronic modules, orienting the mounting surface without the mold material disposed thereon, relative to the mounting surface with the mold material disposed thereon to cause the mold material to substantially surround each electronic module while maintaining a minimum distance between the electronic modules mounted on each mounting surface. The techniques further include removing the mounting surfaces from the mold compound to yield a multi-chip semiconductor device.

Abstract: Techniques for constructing a multi-chip module semiconductor device are provided herein. The techniques include placing electronic modules on a first surface and a second surface, with electrical connections for the electronic modules being proximate to respectively mounted surfaces, disposing a mold material on one of the mounting surfaces to substantially surround corresponding electronic modules, orienting the mounting surface without the mold material disposed thereon, relative to the mounting surface with the mold material disposed thereon to cause the mold material to substantially surround each electronic module while maintaining a minimum distance between the electronic modules mounted on each mounting surface. The techniques further include removing the mounting surfaces from the mold compound to yield a multi-chip semiconductor device.

Abstract: A Microelectromechanical (MEMS) device that can minimize the effects of fabrication tolerances on the operation of the device can include a MEMS electromagnetic actuator to selectively generate displacement forces to displace an actuable element along a path. A cantilever can apply an opposing force to the actuable element to control the amount of displacement. Coil ends of the actuator can be shaped to vary a gap distance between the coil ends, and/or the magnetic portion of the actuable element may be shaped, so as to vary the force applied to the actuable element along the displacement axis. One or more pins located in the deflection path of the cantilever can contact the cantilever at one or more points so as to change the bending resistance of the cantilever. The cross-section of the cantilever can also be varied along its length so as to change the bending resistance of the cantilever.

Abstract: A Microelectromechanical (MEMS) device that can minimize the effects of fabrication tolerances on the operation of the device can include a MEMS electromagnetic actuator to selectively generate displacement forces to displace an actuable element along a path. A cantilever can apply an opposing force to the actuable element to control the amount of displacement. Coil ends of the actuator can be shaped to vary a gap distance between the coil ends, and/or the magnetic portion of the actuable element may be shaped, so as to vary the force applied to the actuable element along the displacement axis. One or more pins located in the deflection path of the cantilever can contact the cantilever at one or more points so as to change the bending resistance of the cantilever. The cross-section of the cantilever can also be varied along its length so as to change the bending resistance of the cantilever.