Abstract: In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.

Abstract: In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.

Abstract: In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.

Abstract: In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.

Abstract: A composite circuit protection device includes a laminar insulating member and first and second laminar circuit protection devices.

Abstract: A composite circuit protection device includes a laminar insulating member and first and second laminar circuit protection devices.

Abstract: A composite circuit protection device includes a laminar insulating member and first and second laminar circuit protection devices.

Abstract: A composite circuit protection device includes a laminar insulating member and first and second laminar circuit protection devices.

Abstract: A method and apparatus for providing a more reliable protection device and an improved PIC power integrated switch. Accordingly, the over-temperature status of the switch as well as the overcurrent status of each of a plurality of ports of the switch are detected. If there is over-temperature, ports with the overcurrent status are identified as a potential cause. These ports are then switched off. After a predetermined waiting time period during which the switch temperature is expected to decrease, the over-temperature status of the switch is again checked. If the over-temperature disappears, then the ports with non-overcurrent status remain on. However, if the over-temperature persists, then all of the ports are turned off. The improved PIC switch thus increases the dynamic operation range of the conventional PIC switch, while ensuring normal operations.

Abstract: Electrical circuit protection arrangements with PTC devices and mechanical switches. The combinations of this invention permit the use of mechanical switches and PTC devices to switch voltages and currents in normal circuit operations, wherein the voltage and/or current ratings of the mechanical switches and PTC devices are much less than the normal operating voltages and currents of the circuits. This feature permits the use of smaller and less expensive mechanical switches and PTC device than would otherwise be required in such circuits. The arrangements of switches and PTC devices also permit the PTC devices to limit the magnitude of the fault current passed to the circuit.

Abstract: An electrical protection system which uses a ground fault interrupter (GFI) to protect a circuit from (A) ground faults and (B) overcurrents and/or overvoltages. For overcurrent protection, a control element may be coupled in series with the line or return input to the GFI, and a bypass element may be coupled in parallel with the control element and the GFI. In case of an overcurrent, the control element causes current to be diverted through the bypass element, thereby creating a current imbalance in the GFI circuitry causing the GFI to open the circuit. For overvoltage protection, a bypass element (e.g. a varistor) may be coupled between, e.g., the line sense input of the GFI and the return sense input of the GFI. In case of an overvoltage, the bypass element conducts current, thereby creating a current imbalance in the GFI circuitry causing the GFI to open the circuit.