Patents by Inventor Justin D. Patten

Justin D. Patten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8631687
    Abstract: An indentation assembly for sub-micron testing includes an indentation tip and a tip holder coupled with the indentation tip. The tip holder includes a first thermal conductivity and a first coefficient of thermal expansion. A tip holder mount configured for coupling with a transducer and the tip holder, the tip holder mount having a second thermal conductivity greater than the first thermal conductivity, and the tip holder mount has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion. The tip holder mount has a mount length, and the tip holder further has a tip holder length greater that the mount length. The tip holder remotely positions the tip holder mount relative to the indentation tip. The tip holder length, volume and the first thermal conductivity cooperate to throttle heat transfer through the tip holder prior to reaching the tip holder mount.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: January 21, 2014
    Assignee: Hysitron, Inc.
    Inventors: Justin D. Patten, Christopher David Young, Lucas Paul Keranen
  • Publication number: 20110252874
    Abstract: An indentation assembly for sub-micron testing includes an indentation tip and a tip holder coupled with the indentation tip. The tip holder includes a first thermal conductivity and a first coefficient of thermal expansion. A tip holder mount configured for coupling with a transducer and the tip holder, the tip holder mount having a second thermal conductivity greater than the first thermal conductivity, and the tip holder mount has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion. The tip holder mount has a mount length, and the tip holder further has a tip holder length greater that the mount length. The tip holder remotely positions the tip holder mount relative to the indentation tip. The tip holder length, volume and the first thermal conductivity cooperate to throttle heat transfer through the tip holder prior to reaching the tip holder mount.
    Type: Application
    Filed: April 19, 2011
    Publication date: October 20, 2011
    Applicant: HYSITRON, INC.
    Inventors: Justin D. Patten, Christopher David Young, Lucas Paul Keranen