Abstract: Methods of manufacturing a cooling system include providing a core or plate having first and second sides, forming surface channels on the second side, and providing a fluid inlet and a fluid outlet on the first side coupled to the channels. A cover is configured to enclose the channels, and the cover and the core or plate are joined by interference or thermal fitting to form a sealed structure. In certain embodiments, the cover includes a peripheral raised wall that receives a peripheral edge of the plate to facilitate coupling. The methods provide compact cooling systems that enable efficient circulation of fluid through surface channels while maintaining reliable thermal transfer.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling method includes pumping a working fluid with an electro-osmotic (EO) pump through a fluid circuit; collecting a gas produced from the operation of the EO pump upon the working fluid—the collection of gas inducing a saturation of the gas in the fluid circuit; and radiating heat from the working fluid via a heat exchanger. In some embodiments, the method involves providing a core having channels for transporting the working fluid, and placing the core in thermal communication with electronic components that generate heat. The core is placed in fluid communication with the EO pump. In certain embodiments, the core, EO pump, gas collector, and heat exchanger are coupled to provide a substantially leak proof system that does not allow gas molecules to escape from the fluid circuit.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a core having a plurality of surface channels configured to facilitate the transport of a working fluid. The cooling system can include a cover configured to cover the surface channels, and further configured to couple to the core to form a leak proof seal with an interference fit. In some embodiments, the interference fit can be the result of a thermal fitting. The core can be a metal core printed circuit board. The core can be configured to be in thermal communication with a printed circuit board. In certain embodiments, the surface channels are in communication with a fluid inlet and a fluid outlet; the fluid inlet and the fluid outlet can be placed on a side of the core opposite a side of the core having the surface channels.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to one or more gas accumulators, a heat exchanger, and a core. In some embodiments, the cooling system further includes a cover coupled to the core with an interference fit, which can be (for example) a thermal fitting. In certain embodiments, the core includes surface channels for transporting a working fluid. In one embodiment, the cover is configured to cover the surface channels. In some embodiments, the gas collectors, pump, and heat exchanger are mounted on a surface of the core that is opposite to a surface of the core covered by the cover.

Abstract: Disclosed are systems and methods for cooling. In one embodiment, a cooling system can include an electro-osmotic (EO) pump operationally coupled, in a fluid circuit, to a heat exchanger and to one or more gas collectors. In some embodiments, the EO pump can be coupled to a gas collector with a thermal fitting. In certain embodiments, the heat exchanger can be coupled to the EO pump and to the second gas collector with thermal fittings. In one embodiment, the cooling system can be used to facilitate cooling, for example, a printed circuit board.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to a gas accumulator. The pump can be operationally coupled to a heat exchanger in a fluid circuit. The gas accumulator can be coupled to a core. In some embodiments, the pump is an electro-osmotic pump, and the core is a metal core printed circuit board. In certain embodiments, the gas accumulator is coupled to the pump with a thermal fitting. In one embodiment, the pump, gas accumulator, and heat exchanger are mounted on a surface of the core.

Abstract: Disclosed are systems and methods for cooling electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open, fluid channels on a first core side; providing a cover configured to cover the channels, and the cover further configured to couple to the core to form a leak proof seal. In some embodiments, a leak proof seal can be obtained through an interference fit. In certain embodiments, a leak proof seal can be obtained through a thermal fitting. In one embodiment, the core is shrank through cooling and then placed inside the cover. In some embodiments, the cover is expanded through heating and the core is placed inside the cover. In certain embodiments, the core is a metal core printed circuit board. In one embodiment, an electro-osmotic pump, a gas accumulator, and a heat exchanger can be operationally coupled to the channels.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open channels on a surface of the core; coupling a cover to the core to cover the open channels; and coupling the cover to the core with a thermal fitting. In some embodiments, an electro-osmotic (EO) pump, a heat exchanger, and one or more gas accumulators are coupled to the core via a fluid circuit. In certain embodiments, a first gas accumulator is coupled to the EO pump with a thermal fitting, the EO pump is coupled to the heat exchanger with a thermal fitting, and the heat exchange is coupled to a second gas accumulator with a thermal fitting. In one embodiment, the first gas accumulator and the second gas accumulator are coupled to the core with thermal fittings.

Abstract: Disclosed are systems and methods for cooling electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open, fluid channels on a first core side; providing a cover configured to cover the channels, and the cover further configured to couple to the core to form a leak proof seal. In some embodiments, a leak proof seal can be obtained through an interference fit. In certain embodiments, a leak proof seal can be obtained through a thermal fitting. In one embodiment, the core is shrank through cooling and then placed inside the cover. In some embodiments, the cover is expanded through heating and the core is placed inside the cover. In certain embodiments, the core is a metal core printed circuit board. In one embodiment, an electro-osmotic pump, a gas accumulator, and a heat exchanger can be operationally coupled to the channels.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to one or more gas accumulators, a heat exchanger, and a core. In some embodiments, the cooling system further includes a cover coupled to the core with an interference fit, which can be (for example) a thermal fitting. In certain embodiments, the core includes surface channels for transporting a working fluid. In one embodiment, the cover is configured to cover the surface channels. In some embodiments, the gas collectors, pump, and heat exchanger are mounted on a surface of the core that is opposite to a surface of the core covered by the cover.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open channels on a surface of the core; coupling a cover to the core to cover the open channels; and coupling the cover to the core with a thermal fitting. In some embodiments, an electro-osmotic (EO) pump, a heat exchanger, and one or more gas accumulators are coupled to the core via a fluid circuit. In certain embodiments, a first gas accumulator is coupled to the EO pump with a thermal fitting, the EO pump is coupled to the heat exchanger with a thermal fitting, and the heat exchange is coupled to a second gas accumulator with a thermal fitting. In one embodiment, the first gas accumulator and the second gas accumulator are coupled to the core with thermal fittings.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling method includes pumping a working fluid with an electro-osmotic (EO) pump through a fluid circuit; collecting a gas produced from the operation of the EO pump upon the working fluid—the collection of gas inducing a saturation of the gas in the fluid circuit; and radiating heat from the working fluid via a heat exchanger. In some embodiments, the method involves providing a core having channels for transporting the working fluid, and placing the core in thermal communication with electronic components that generate heat. The core is placed in fluid communication with the EO pump. In certain embodiments, the core, EO pump, gas collector, and heat exchanger are coupled to provide a substantially leak proof system that does not allow gas molecules to escape from the fluid circuit.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a core having a plurality of surface channels configured to facilitate the transport of a working fluid. The cooling system can include a cover configured to cover the surface channels, and further configured to couple to the core to form a leak proof seal with an interference fit. In some embodiments, the interference fit can be the result of a thermal fitting. The core can be a metal core printed circuit board. The core can be configured to be in thermal communication with a printed circuit board. In certain embodiments, the surface channels are in communication with a fluid inlet and a fluid outlet; the fluid inlet and the fluid outlet can be placed on a side of the core opposite a side of the core having the surface channels.

Abstract: Disclosed are systems and methods for cooling. In one embodiment, a cooling system can include an electro-osmotic (EO) pump operationally coupled, in a fluid circuit, to a heat exchanger and to one or more gas collectors. In some embodiments, the EO pump can be coupled to a gas collector with a thermal fitting. In certain embodiments, the heat exchanger can be coupled to the EO pump and to the second gas collector with thermal fittings. In one embodiment, the cooling system can be used to facilitate cooling, for example, a printed circuit board.

Abstract: Disclosed are systems and methods for pumping liquids in a fluid circuit. In one embodiment, a pumping system can include a gas accumulator operationally coupled to an electro-osmotic (EO) pump. The gas accumulator can include a chamber configured to collect a gas produced from the operation of the EO pump. In some embodiments, the gas accumulator can include a gas accumulator inlet configured to be coupled to a fluid outlet of the fluid circuit. In certain embodiments, the gas accumulator can include a pump receptacle configured to couple to the EO pump by, for example, a thermal fitting. In one embodiment, a pumping system can include a second gas accumulator configured to operationally couple to a fluid inlet of the fluid circuit. In some embodiments, the EO pump and gas accumulator can be included in a cooling system of, for example, a printed circuit board.

Abstract: Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to a gas accumulator. The pump can be operationally coupled to a heat exchanger in a fluid circuit. The gas accumulator can be coupled to a core. In some embodiments, the pump is an electro-osmotic pump, and the core is a metal core printed circuit board. In certain embodiments, the gas accumulator is coupled to the pump with a thermal fitting. In one embodiment, the pump, gas accumulator, and heat exchanger are mounted on a surface of the core.

Abstract: A multicell rechargeable battery with a dynamic power management system has an enclosure, multiple cell clamps, and a power management system. The enclosure is the outer casing that holds the cell clamps in place. Each of the cell clamps is a device used to hold a single cell for the multicell battery. The enclosure has two trays that sandwich the cell clamps and keep the enclosed cells in place. Each cell clamp has a pair of endcaps and a pair of terminals. The terminals are positioned within the endcaps so that the enclosed cells can be placed into electrical communication with the power management system. The power management system dynamically modifies the circuit connection between each of the cell clamps to compensate for changes in the electrical state of the enclosed cells.