Patents by Inventor Justin Everman

Justin Everman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stud bumps for die alignment
    Patent number: 7880287
    Abstract: Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: February 1, 2011
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Bruno Samuel, Charles Carpenter, John Beall, Justin Everman, Benne Velsher