Patents by Inventor Justin Hackley

Justin Hackley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multichip device with temperature isolating bump bonds
    Patent number: 10644218
    Abstract: A superconducting structure is provided that comprises a first superconducting device coupled to a second superconducting device employing a plurality of superconducting bump bond structures. Each of the plurality of superconducting bump bond structures comprise a first normal metal layer disposed on the top surface of a given one of a plurality of first contact pads, a second normal metal layer disposed on the top surface of a given one of a plurality of second contact pads, and a superconducting metal layer disposed between the first normal metal layer and the second normal metal layer. The metal thicknesses of each of the first normal metal layer, the second normal metal layer, and the specific material of the superconducting metal and normal metal are selected to inhibit the transfer of heat between the first superconducting device and the second superconducting device.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: May 5, 2020
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Aaron Ashley Hathaway, Robert Miles Young, Patrick Alan Loney, Justin Hackley