Abstract: In some embodiments of the present disclosure, a method for manufacturing a thin film resistor after completing a copper chemical mechanical polishing (CMP) process on a copper process module may include: depositing a dielectric barrier layer across at least two structures; depositing a second dielectric layer atop the dielectric barrier as a hard mask; patterning a trench using photo lithography; etching the trench through the hard mask and stopping in or on the dielectric barrier; removing any remaining photoresist from the photo lithography process; etching the trench through the dielectric barrier thereby exposing a copper surface for each of the at least two copper structures; and depositing thin-film resistor material into the trench and bridging across the resulting at least two exposed copper surfaces.