Abstract: Certain aspects of the present disclosure provide a system for processing data, comprising a plurality of processing nodes, each processing node comprising at least one processor and at least one radio frequency (RF) chain and at least one link for conductive RF communication between or among the processing nodes using a wireless communications protocol.

Abstract: Techniques are described herein for audio processing. For instance, a technique can include receiving, from one or more microphones, an audio signal; receiving a periodic timing signal based on the periodic timing signal; combining the audio signal and the periodic timing signal into an audio stream; generating a time stamp based on the received periodic timing signal; and adding the generated time stamp to the audio stream based on the periodic timing signal in the audio stream.

Abstract: A system and method of improving the efficiency in the power consumption of an audio system. In essence, the technique is to adjust the power delivered from the power supply to the analog section, such as the power amplifier, in response to the volume level indicated by the volume control module and/or in response to the detected characteristic of the input audio signal. Thus, in this manner, the analog section is operated in a manner that is related to the level of the signal it is processing. Additionally, the system and method also relate to a technique of adjusting the dynamic ranges of the digital signal and the analog signal to improve the overall dynamic range of the system without needing to consume additional power.

Abstract: In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first package-substrate connection, a second package-substrate connection, and metallization coupling the first package-substrate connection to the second package-substrate connection. The substrate is coupled to the package via the first package-substrate connection and the second package-substrate connection. The substrate includes a plurality of power domains and a power control unit. The second package-substrate connection of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first package-substrate connection of the package.

Abstract: A dual current switch detection circuit with selective activation is disclosed. In a particular embodiment, the switch detection circuit comprises an input node coupled to a switch to receive an input signal from the switch, a first current source coupled to the input node, a second current source coupled to the input node, and a detection circuit having an input coupled to the input node and an output coupled to the second current source to selectively activate the second current source.

Abstract: In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first package-substrate connection, a second package-substrate connection, and metallization coupling the first package-substrate connection to the second package-substrate connection. The substrate is coupled to the package via the first package-substrate connection and the second package-substrate connection. The substrate includes a plurality of power domains and a power control unit. The second package-substrate connection of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first package-substrate connection of the package.

Abstract: In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first pin, a second pin, and metallization coupling the first pin to the second pin. The substrate is coupled to the package via the first pin and the second pin. The substrate includes a plurality of power domains and a power control unit. The second pin of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first pin of the package. The logic selectively activates the switch to distribute power to the particular power domain via the metallization of the package.

Abstract: Embodiments of the present invention are directed to switched-mode power supply (SMPS) circuits and methods thereof. The SMPS circuit receives information related to a future load change. For example, the information may be received at a decoder (e.g., a serial bus interface (SBI) decoder) from a microprocessor or microcontroller, such as a mobile station modem (MSM). The SMPS circuit may include an analog-to-digital converter configured to sample an output voltage of the SMPS circuit to determine a time when the future load change occurs. The SMPS circuit may further include a transient recovery circuit (TRC) for stabilizing the output voltage based on the received information when the future load change occurs. For example, the TRC calculates a duty cycle used to transition states of switches of the SMPS circuit to compensate for the future load change.

Abstract: A device is disclosed that includes a first pin to supply power to a first power domain of an integrated circuit, a second pin to supply power to a second power domain of the integrated circuit, a switching regulator and a controller. The switching regulator is coupled to the first pin to provide a first regulated power supply to the first power domain and is coupled to the second pin to provide a second regulated power supply to the second power domain. The controller is coupled to the first pin and to the second pin to selectively reduce current flow to at least the second pin during a low power event.

Abstract: A dual current switch detection circuit with selective activation is disclosed. In a particular embodiment, the switch detection circuit comprises an input node coupled to a switch to receive an input signal from the switch, a first current source coupled to the input node, a second current source coupled to the input node, and a detection circuit having an input coupled to the input node and an output coupled to the second current source to selectively activate the second current source.

Abstract: A high-speed semiconductor device includes a substrate having an upper substrate surface, a lower substrate surface, and a periphery bounding the upper and the lower substrate surfaces, the substrate further having an upper substrate ground trace providing an electrical path to the lower substrate surface through a substrate ground via; an array of solder balls attached to the lower substrate surface, the array of solder balls including a plurality of ground solder balls disposed at the periphery and electrically connected to the substrate ground via.

Abstract: A system and method of improving the efficiency in the power consumption of an audio system. In essence, the technique is to adjust the power delivered from the power supply to the analog section, such as the power amplifier, in response to the volume level indicated by the volume control module and/or in response to the detected characteristic of the input audio signal. Thus, in this manner, the analog section is operated in a manner that is related to the level of the signal it is processing. Additionally, the system and method also relate to a technique of adjusting the dynamic ranges of the digital signal and the analog signal to improve the overall dynamic range of the system without needing to consume additional power.

Abstract: Embodiments of the present invention are directed to switched-mode power supply (SMPS) circuits and methods thereof. The SMPS circuit receives information related to a future load change. For example, the information may be received at a decoder (e.g., a serial bus interface (SBI) decoder) from a microprocessor or microcontroller, such as a mobile station modem (MSM). The SMPS circuit may include an analog-to-digital converter configured to sample an output volgatle of the SMPS circuit to determine a time when the future load change occurs. The SMPS circuit may further include a transient recovery circuit (TRC) for stabilizing the output voltage based on the received information when the future load change occurs. For example, the TRC calculates a duty cycle used to transition states of switches of the SMPS circuit to compensate for the future load change.

Abstract: A device is disclosed that includes a first pin to supply power to a first power domain of an integrated circuit, a second pin to supply power to a second power domain of the integrated circuit, a switching regulator and a controller. The switching regulator is coupled to the first pin to provide a first regulated power supply to the first power domain and is coupled to the second pin to provide a second regulated power supply to the second power domain. The controller is coupled to the first pin and to the second pin to selectively reduce current flow to at least the second pin during a low power event.