Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract: Handling devices and methods for handling microelectronic assemblies are disclosed herein. In one embodiment, a frame includes a first end portion, a second end portion that is spaced along a longitudinal axis from the first end portion, a first side portion that couples the first and second end portions, and a second side portion that couples the first and second end portions and is spaced along a lateral axis from the first side portion. An insert is releasably disposed on the frame and includes a plurality of pockets, with individual pockets positioned to releasably receive a respective one of the microelectronic assemblies. A retainer is positioned to secure and release the insert with respect to the frame.

Abstract: A compliant contactor interfaces a semiconductor device under test with a tester. The compliant contactor accepts a variety of different sized semiconductor devices along with a variety of different pinouts of the semiconductor devices. The compliant contactor includes an upper alignment block and a lower alignment block which receives the contact pins of the tester. The upper alignment block may move within a predefined distance with respect to the lower alignment block to account for any tester movement, thermal expansion or contraction, or other factors. In an alternative embodiment, the compliant contactor may move in three directions with respect to the test board. In this embodiment, a contact pad provides electrical connection between a daughter card and the test board. The contact pad may be a compressible elastomeric connector.

Abstract: A compliant contactor interfaces a semiconductor device under test with a tester. The compliant contactor accepts a variety of different sized semiconductor devices along with a variety of different pinouts of the semiconductor devices. The compliant contactor includes an upper alignment block and a lower alignment block which receives the contact pins of the tester. The upper alignment block may move within a predefined distance with respect to the lower alignment block to account for any tester movement, thermal expansion or contraction, or other factors. In an alternative embodiment, the compliant contactor may move in three directions with respect to the test board. In this embodiment, a contact pad provides electrical connection between a daughter card and the test board. The contact pad may be a compressible elastomeric connector.

Abstract: An extended length, high frequency contactor block has a plurality of signal conductors, each having a contact element formed at its end. Each signal conductor has an inductance which is an inherent material property. The signal conductors are disposed within a plurality of layers configured to form a capacitor with each signal conductor. The plurality of layers is further configured to provide a capacitance which has a controlled relationship to the inductance of the signal conductors. The relationship may be controlled such that the impedance of each signal conductor is minimized. Because impedance is independent of length, the contactor block can be made to any length desired. A method of manufacturing a contactor block is also disclosed.

Abstract: A compliant contactor interfaces a semiconductor device under test with a tester. The compliant contactor accepts a variety of different sized semiconductor devices along with a variety of different pinouts of the semiconductor devices. The compliant contactor includes an upper alignment block and a lower alignment block which receives the contact pins of the tester. The upper alignment block may move within a predefined distance with respect to the lower alignment block to account for any tester movement, thermal expansion or contraction, or other factors. In an alternative embodiment, the compliant contactor may move in three directions with respect to the test board. In this embodiment, a contact pad provides electrical connection between a daughter card and the test board. The contact pad may be a compressible elastomeric connector.