Patents by Inventor Justin Liu
Justin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240104275Abstract: In various embodiments, a design exploration application generates images that represent design alternatives for three-dimensional (3D) objects. The design exploration application generates a keyword prompt based on design intent text that describes a 3D object. The design exploration application executes a first machine learning model on the keyword prompt to generate a first set of keywords. The design exploration application generates a rephrase prompt based on a second set of keywords that includes at least one keyword from the first set of keywords. The design exploration application executes the first machine learning model on the rephrase prompt to generate a final text prompt. The design exploration application executes a second machine learning model on the final text prompt to generate a set of images.Type: ApplicationFiled: August 8, 2023Publication date: March 28, 2024Inventors: Vivian LIU, Jo Karel VERMEULEN, George William FITZMAURICE, Justin Frank MATEJKA
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Publication number: 20240090718Abstract: A surface cleaning device includes a nozzle and an odor dial assembly. The nozzle includes a nozzle housing and a dirty air passageway. The odor dial assembly include a fragrance member and a dial body configured to be removably coupled to the nozzle housing. The dial body at least partially defines a fragrance cavity configured to at least partially receive the fragrance member and a fragrance passageway extending therethrough. The odor dial assembly is configured to transition between a plurality of user-selectable positions to adjust an amount of fragrance particles released by the fragrance member into the dirty air passageway.Type: ApplicationFiled: November 30, 2023Publication date: March 21, 2024Inventors: Ryan M. COPELAND, Samuel J. LEVINE, Justin G. RILEY, Daniel R. DER MARDEROSIAN, Qiang LIU, Peng Fei LIU, Kui LIU, Bo GAO, Jiancheng WANG, Jeremy MCDANIEL
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Patent number: 11930620Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.Type: GrantFiled: June 27, 2020Date of Patent: March 12, 2024Assignee: Intel CorporationInventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
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Publication number: 20240081067Abstract: A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. The operative channel-material strings in the laterally-spaced memory blocks comprise part of a memory plane. An elevationally-extending wall is in the memory plane laterally-between immediately-laterally-adjacent of the memory blocks and that completely encircles an island that is laterally-between immediately-laterally-adjacent of the memory blocks in the memory plane. Other embodiments, including method are disclosed.Type: ApplicationFiled: November 14, 2023Publication date: March 7, 2024Applicant: Micron Technology, Inc.Inventors: Lifang Xu, Indra V. Chary, Justin B. Dorhout, Jian Li, Haitao Liu, Paolo Tessariol
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Publication number: 20240076752Abstract: The invention provides methods, kits, and related compositions for rapid, low-cost, point of care detection of an organism, such as a virus or bacteria, in a biological or environmental sample using isothermal nucleic acid amplification.Type: ApplicationFiled: January 5, 2022Publication date: March 7, 2024Inventors: Fahim Farzadfard, Asmamaw Wassie, Jeong Seuk Kang, Ho-Jun Suk, Kayla Vodehnal, Justin Liu, Jianghong Min
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Publication number: 20240072511Abstract: The present Specification is directed to the heterogeneous integration of compound-semiconductor devices on indirect-bandgap material substrates. A chip comprising compound-semiconductor layer stack disposed on a handle substrate of germanium is bonded, stack-side down, to a silicon layer disposed on a host substrate. The use of a germanium handle substrate enables the handle substrate to be removed after bonding using methods that are highly selective for germanium over the compound semiconductor layer stack. As a result, the compound-semiconductor layer stack does not need to be protected during handle substrate removal and the handle substrate can be completely removed without causing damage to the compound-semiconductor layer stack. As a result, after handle-substrate removal, the materials of the layer stack can be processed further to define one or more optically active devices in conventional fashion.Type: ApplicationFiled: August 9, 2023Publication date: February 29, 2024Inventors: Justin Colby NORMAN, Brian KOCH, Alan LIU
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Patent number: 11911482Abstract: Disclosed herein are self-assembling protein nanoparticles comprising passenger molecules of interest.Type: GrantFiled: August 25, 2020Date of Patent: February 27, 2024Assignee: The Regents of the University of CaliforniaInventors: Todd Yeates, Yen-Ting Lai, Justin Miller, Phillip Nguyen, Yashes Srinivasan, Nithin Dharmaraj, Scott Taylor, Andrew Liu
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Patent number: 11051095Abstract: A charging case for charging and storing a pair of earbuds is provided. The charging case comprises: a case body having an upper section and a lower section, the lower section housing at least a battery and a PCB, the upper section having a pair of sockets to accommodate the pair of earbuds, respectively; and a USB cable comprising a distal end portion including a USB connector, a cable body housing electrical wires coupled to the USB connector, and a proximal end portion non-removably attached to the case body. The electrical wires are guided through the housing wall into an inner space of the case body where end portions of the electrical wires are soldered onto the PCB. A recessed area is formed on the exterior surface of the case body to accommodate the attached USB cable while not in use.Type: GrantFiled: March 20, 2019Date of Patent: June 29, 2021Assignee: Peag, LLCInventors: Winthrop Cramer, Justin Liu
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Publication number: 20200304899Abstract: A charging case for charging and storing a pair of earbuds is provided. The charging case comprises: a case body having an upper section and a lower section, the lower section housing at least a battery and a PCB, the upper section having a pair of sockets to accommodate the pair of earbuds, respectively; and a USB cable comprising a distal end portion including a USB connector, a cable body housing electrical wires coupled to the USB connector, and a proximal end portion non-removably attached to the case body. The electrical wires are guided through the housing wall into an inner space of the case body where end portions of the electrical wires are soldered onto the PCB. A recessed area is formed on the exterior surface of the case body to accommodate the attached USB cable while not in use.Type: ApplicationFiled: March 20, 2019Publication date: September 24, 2020Applicant: Peag, LLC dba JLab AudioInventors: Winthrop Cramer, Justin Liu
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Patent number: 10558424Abstract: A speaker device with equalization (EQ) control is provided, wherein the speaker device may be a pair of earbuds/earphones or a headset having a pair of headphones, comprising: an audio receiving port for receiving audio signals from an audio source, a circuitry comprising at least a processor and a memory, the processor being configured to execute one or more firmware or software programs to perform tasks for processing the audio signals, including equalization of the audio signals according to one of multiple EQ settings stored in the memory, a user input terminal for detecting a user input to select one of the EQ settings; and a pair of speaker drivers for emitting sound corresponding to the processed audio signals.Type: GrantFiled: June 28, 2019Date of Patent: February 11, 2020Assignee: Peag, LLCInventors: Winthrop Cramer, Justin Liu
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Patent number: 10394521Abstract: A speaker device with equalization (EQ) control is provided, wherein the speaker device may be a pair of earbuds or earphones or a headset, comprising: an audio receiving port for receiving audio signals from an audio source, a circuitry comprising at least a processor and a memory, the processor being configured to execute one or more firmware or software programs to perform tasks for processing the audio signals, including equalization of the audio signals according to one of multiple EQ settings stored in the memory, a user input terminal for detecting a user input to select one of the EQ settings; and a speaker driver for emitting sound corresponding to the processed audio signals.Type: GrantFiled: December 6, 2018Date of Patent: August 27, 2019Assignee: Peag, LLCInventors: Winthrop Cramer, Justin Liu
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Patent number: 8975514Abstract: Cable assemblies include at least a first wire and a second wire. The wires are enclosed, using injection molding, by a respective layer of thermo-resistant material. During the injection molding, the first wire and second wire are kept substantially straight so as to avoid kinks in at least one of the first wire and the second wire that can develop subsequent to the molding if a wire is not substantially straight. The tension associated with the first wire and the second wire is kept within a predetermined range or below a predetermined threshold. The predetermined range/threshold depends on a temperature associated with the injection molding. The injection molding can provide a zip structure over the wires such that the zip structure can be zipped-together and zipped-apart to prevent entanglement of the wires when used by a user.Type: GrantFiled: November 4, 2011Date of Patent: March 10, 2015Assignee: Zipbuds, LLC.Inventors: Erik Groset, Justin Liu, Michael Klasco, Robin Defay
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Publication number: 20150016655Abstract: An electrical wire assembly is described that has a first audio electrical wire and a second audio electrical wire. These audio electrical wires can be encapsulated by a thermo-resistant material. The thermo-resistant material encapsulating the first audio electrical wire can encapsulate a ridge, and the thermo-resistant material encapsulating the second audio electrical wire can encapsulate a groove. A slider can be configured to slide along at least a portion of lengths of the first audio electrical wire and the second audio electrical wire to releasably attach the ridge and the groove. A jack can be connected to one end of the audio electrical wires. The jack can be configured to connect to an audio producing device. Earphones or headphones can be connected to the other ends of the first audio electrical wire and the second audio electrical wire. Related methods, systems, apparatuses, and products are also described.Type: ApplicationFiled: July 17, 2014Publication date: January 15, 2015Inventors: Erik Groset, Robin DeFay, Justin Liu
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Publication number: 20140050349Abstract: A zipper assembly is described that includes a first set of electrical wires, a second set of electrical wires, and a first set of zipper teeth. The first set of electrical wires can be encapsulated by a first inner layer made of a thermo-resistant material. The second set of electrical wires can be encapsulated by a second inner layer made of the thermo-resistant material. The first set of zipper teeth can be connected to a zipper tape fabric that is woven with the first inner layer and the second inner layer. The first set of zipper teeth can be configured to be attached to an article of clothing. The first set of zipper teeth can be releasably attached to a second set of zipper teeth attached to the article of clothing. Related methods, systems, apparatuses, and products are also described.Type: ApplicationFiled: October 30, 2013Publication date: February 20, 2014Inventors: Erik Groset, Robin DeFay, Justin Liu, Michael Klasco
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Patent number: 8455758Abstract: Preferred assemblies are directed to a cable assembly that includes a first electrical wire and a second electrical wire; with a thermo-resistant material that is molded around the wires. Zipper teeth are molded to the thermo-resistant material of both of the wires. The zipper teeth on the first wire are releasably attached to the zipper teeth on the second wire, and at least one reinforcing fiber is encapsulated with one of the wires.Type: GrantFiled: November 8, 2010Date of Patent: June 4, 2013Assignee: Zipbuds, LLCInventors: Erik Groset, Justin Liu, Michael Klasco, Robin DeFay
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Publication number: 20120284258Abstract: Methods, systems, and computer program products for searching clinical terminology databases, and more specifically systems and methods for searching structured terminology databases that possess structures for terminology synonyms and semantic parent concept relationships—such as the Systematized Nomenclature of Medicine—Clinical Terms (SNOMED CT) data standard—are provided. This involves interfacing with the database using an application program interface to enable communication between the database and a search module, and searching the database using the search module to generate an ordered list of database records by defining a search string, retrieving database records from the database by matching terms associated with concepts in the database to the search string, and retrieving the database records for the concepts associated with the matched terms. The retrieved results can be ordering based upon a relevancy criterion.Type: ApplicationFiled: November 17, 2010Publication date: November 8, 2012Applicant: University Health NetworkInventor: Justin Liu
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Publication number: 20120045084Abstract: Cable assemblies comprising at least a first wire and a second wire are provided. The wires are enclosed, using injection molding, by a respective layer of thermo-resistant material. During the injection molding, the first wire and second wire are kept substantially straight so as to avoid kinks in at least one of the first wire and the second wire that can develop subsequent to the molding if a wire is not substantially straight. The tension associated with the first wire and the second wire is kept within a predetermined range or below a predetermined threshold. The predetermined range/threshold depends on a temperature associated with the injection molding. The injection molding can provide a zip structure over the wires such that the zip structure can be zipped-together and zipped-apart to prevent entanglement of the wires when used by a user.Type: ApplicationFiled: November 4, 2011Publication date: February 23, 2012Applicant: D & G Solutions, LLCInventors: Erik Groset, Justin Liu, Michael Klasco, Robin Defay
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Patent number: D684137Type: GrantFiled: March 16, 2012Date of Patent: June 11, 2013Assignee: Zipbuds, LLCInventors: Erik Groset, Justin Liu, Michael Klasco, Robin DeFay
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Patent number: D684138Type: GrantFiled: March 16, 2012Date of Patent: June 11, 2013Assignee: Zipbuds, LLCInventors: Erik Groset, Justin Liu, Michael Klasco, Robin DeFay
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Patent number: D684559Type: GrantFiled: March 16, 2012Date of Patent: June 18, 2013Assignee: Zipbuds, LLCInventors: Erik Groset, Justin Liu, Michael Klasco, Robin DeFay