Abstract: Component fabrication and in particular fabrication by deposition processes for large components is made more convenient by initially depositing a masking deposition layer 2 upon a thin substrate 1 such that subsequently shaped metal deposition techniques can be used. Previously, the relatively thin nature of the substrate 1 has rendered the hot heat plume 11 of the shaped metal deposition technique too intrusive. It will be understood that this heat plume 11 may distort the thin substrate 1. By initial application of a protective masking deposition layer 2, the underlying substrate is protected by that layer 2 from the heat plume 11 generated by the shaped metal deposition process.

Abstract: A method for recycling an inert gas evacuated from a material deposition process chamber 10 comprises cooling the evacuated inert gas and recirculating a proportion of the cooled gas to the chamber 10 at a first temperature for use as a cooling gas in the material deposition process 12, and recirculating a proportion of the cooled gas to the chamber 10 at a second temperature for use as a shielding gas in the material deposition process 12, the second temperature being higher than the first temperature. Apparatus 22 for recycling an inert gas is also disclosed.

Abstract: A method for recycling an inert gas evacuated from a material deposition process chamber 10 comprises cooling the evacuated inert gas and recirculating a proportion of the cooled gas to the chamber 10 at a first temperature for use as a cooling gas in the material deposition process 12, and recirculating a proportion of the cooled gas to the chamber 10 at a second temperature for use as a shielding gas in the material deposition process 12, the second temperature being higher than the first temperature. Apparatus 22 for recycling an inert gas is also disclosed.